Arjun Krishnan — 17 Patents at Intel

Arjun Krishnan has been granted 17 US patents while listed as an inventor at Intel. The first was granted in 1998 and the most recent in October 2018. Arjun Krishnan ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Arjun Krishnan in Chandler, AZ, US.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10115606	Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby	Yiqun Bai, Yuying Wei, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more	2018-10-30	$31,457,000
9793151	Stiffener tape for electronic assembly	Xavier Francois Brun, Mohit Mamodia, Dingying Xu	2017-10-17	$9,876,000
9704767	Mold compound with reinforced fibers	Suriyakala Ramalingam, Yiqun Bai, Nisha Ananthakrishnan	2017-07-11	$8,311,000
9640415	Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials	Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Hitesh Arora	2017-05-02	$12,076,000
9631065	Methods of forming wafer level underfill materials and structures formed thereby	Anna M. Prakash, James C. Matayabas, Jr., Nisha Ananthakrishnan	2017-04-25	$8,972,000
9620404	Stiffener tape for electronic assembly that includes wafer or panel	Xavier Francois Brun	2017-04-11	$8,965,000
9611372	Narrow-gap flip chip underfill composition	Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai	2017-04-04	$8,141,000
9330993	Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby	Yiqun Bai, Yuying Wei, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more	2016-05-03	$11,131,000
9269596	Narrow-gap flip chip underfill composition	Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai	2016-02-23	$10,383,000
9230833	Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures	Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Yiqun Bai, Purushotham Kaushik Muthur Srinath	2016-01-05	$11,513,000
8999765	Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures	Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Yiqun Bai, Purushotham Kaushik Muthur Srinath	2015-04-07	$25,687,000
8900919	Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials	Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Hitesh Arora	2014-12-02	$19,830,000
7490341	System and associated terminal, method and computer program product for directional channel browsing of broadcast content	Arto Kiiskinen	2009-02-10	$9,245,000
7043261	System, mobile station and method for delivering services	—	2006-05-09	$9,040,000
6381453	Dual mode network call forwarding activation and deactivation	—	2002-04-30	$37,042,000
5924026	Exchange of system and terminal capabilities over the same analog control channel	—	1999-07-13	$30,580,000
5826191	Dual mode network call forwarding activation and deactivation	—	1998-10-20	$23,871,000

Arjun Krishnan — 17 Patents

Issued Patents All Time

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