Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2018-10-30 |
| 9793151 | Stiffener tape for electronic assembly | Xavier Francois Brun, Mohit Mamodia, Dingying Xu | 2017-10-17 |
| 9704767 | Mold compound with reinforced fibers | Suriyakala Ramalingam, Yiqun Bai, Nisha Ananthakrishnan | 2017-07-11 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Hitesh Arora | 2017-05-02 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | Anna M. Prakash, James C. Matayabas, Jr., Nisha Ananthakrishnan | 2017-04-25 |
| 9620404 | Stiffener tape for electronic assembly that includes wafer or panel | Xavier Francois Brun | 2017-04-11 |
| 9611372 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai | 2017-04-04 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2016-05-03 |
| 9269596 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai | 2016-02-23 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2016-01-05 |
| 8999765 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2015-04-07 |
| 8900919 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Hitesh Arora | 2014-12-02 |
| 7490341 | System and associated terminal, method and computer program product for directional channel browsing of broadcast content | Arto Kiiskinen | 2009-02-10 |
| 7043261 | System, mobile station and method for delivering services | — | 2006-05-09 |
| 6381453 | Dual mode network call forwarding activation and deactivation | — | 2002-04-30 |
| 5924026 | Exchange of system and terminal capabilities over the same analog control channel | — | 1999-07-13 |
| 5826191 | Dual mode network call forwarding activation and deactivation | — | 1998-10-20 |