| 11579426 |
Dual collimating lens configuration for optical devices |
Chia-Pin Chiu |
2023-02-14 |
$12,790,000 |
| 11156815 |
Compound parabolic concentrator including protrusion |
Chia-Pin Chiu, Amanuel M. Abebaw, Olga Gorbounova, Ching-Ping Janet Shen, Shan Zhong +1 more |
2021-10-26 |
$21,268,000 |
| 11022792 |
Coupling a magnet with a MEMS device |
Kyle Yazzie, Suriyakala Ramalingam, Liwei Wang, Robert Starkston, Arnab Choudhury +3 more |
2021-06-01 |
$35,542,000 |
| 10615128 |
Systems and methods for electromagnetic interference shielding |
Rajendra C. Dias, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar |
2020-04-07 |
$35,530,000 |
| 10315200 |
Apparatus and system for storing and transporting magnetic devices |
Amanuel M. Abebaw, Mark Saltas, Liwei Wang |
2019-06-11 |
$16,707,000 |
| 10168357 |
Coated probe tips for plunger pins of an integrated circuit package test system |
Wen Yin, Teag R. Haughan, Dingying Xu, Joaquin Aguilar-Santillan |
2019-01-01 |
|
| 10049971 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2018-08-14 |
$20,895,000 |
| 9991211 |
Semiconductor package having an EMI shielding layer |
Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner, Ann Jinyan Xu +2 more |
2018-06-05 |
$24,427,000 |
| 9953929 |
Systems and methods for electromagnetic interference shielding |
Rajendra C. Dias, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar |
2018-04-24 |
$19,097,000 |
| 9704811 |
Perforated conductive material for EMI shielding of semiconductor device and components |
Rajendra C. Dias, Joshua D. Heppner, Mitul Modi |
2017-07-11 |
$8,311,000 |
| 9685413 |
Semiconductor package having an EMI shielding layer |
Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner, Ann Jinyan Xu +2 more |
2017-06-20 |
$9,273,000 |
| 9631065 |
Methods of forming wafer level underfill materials and structures formed thereby |
James C. Matayabas, Jr., Arjun Krishnan, Nisha Ananthakrishnan |
2017-04-25 |
$8,972,000 |
| 9613933 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2017-04-04 |
$8,141,000 |
| 8183697 |
Apparatus and methods of forming an interconnect between a workpiece and substrate |
Lakshmi Supriya, Tommy L. Ashton |
2012-05-22 |
$25,074,000 |
| 7843075 |
Apparatus and methods of forming an interconnect between a workpiece and substrate |
Lakshmi Supriya, Tommy L. Ashton |
2010-11-30 |
$13,201,000 |
| 7776657 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Ashay Dani, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar |
2010-08-17 |
$11,574,000 |
| 7651020 |
Amphiphilic block copolymers for improved flux application |
Linda A. Shekhawat |
2010-01-26 |
$14,937,000 |
| 7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Ashay Dani, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar |
2008-02-19 |
$15,849,000 |
| 6717561 |
Driving a liquid crystal display |
Matthias Pfeiffer, Russell Flack |
2004-04-06 |
$2,672,000 |
