| 11955434 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Yoshihiro Tomita, Eric J. Li, Shawna M. Liff, Javier A. Falcon |
2024-04-09 |
$27,197,000 |
| 11653467 |
Modular system for internet of things and method of assembling the same |
Chris D. Lucero, Khine Han, Christopher Rossi, Hadi Sharifi, Aniekeme Udofia +5 more |
2023-05-16 |
$11,130,000 |
| 11135494 |
Training aid support base and assembly |
— |
2021-10-05 |
|
| 11024559 |
Semiconductor package with electromagnetic interference shielding structures |
Mitul Modi |
2021-06-01 |
$35,542,000 |
| 10825714 |
Stretching retention plate for electronic assemblies |
Daniel Chavez-Clemente, Naida Duranovic |
2020-11-03 |
$38,832,000 |
| 10820437 |
Flexible packaging for a wearable electronic device |
Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne +4 more |
2020-10-27 |
$34,955,000 |
| 10707171 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Tomita YOSHIHIRO, Eric J. Li, Shawna M. Liff, Javier A. Falcon |
2020-07-07 |
$29,601,000 |
| 10672625 |
Electronic device package with recessed substrate for underfill containment |
Sergio Antonio Chan Arguedas, Jimin Yao |
2020-06-02 |
$32,838,000 |
| 10636716 |
Through-mold structures |
Sasha N. Oster, Srikant Nekkanty, Adel A. Elsherbini, Yoshihiro Tomita, Debendra Mallik +2 more |
2020-04-28 |
$36,717,000 |
| 10615128 |
Systems and methods for electromagnetic interference shielding |
Rajendra C. Dias, Anna M. Prakash, Eric J. Li, Nachiket R. Raravikar |
2020-04-07 |
$35,530,000 |
| 10446461 |
Complex cavity formation in molded packaging structures |
Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff |
2019-10-15 |
$18,012,000 |
| 10325866 |
Electronic device packages with conformal EMI shielding and related methods |
Eric J. Li, Rajendra C. Dias, Mitul Modi |
2019-06-18 |
$21,210,000 |
| 10224290 |
Electromagnetically shielded electronic devices and related systems and methods |
Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Eric J. Li |
2019-03-05 |
$19,977,000 |
| 10205292 |
Socket contact techniques and configurations |
Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more |
2019-02-12 |
$25,597,000 |
| 10193493 |
Multi-surface solar cell packaging for self-powered electronic devices |
Debendra Mallik |
2019-01-29 |
$23,219,000 |
| 10111368 |
Flexible substrate retention on a reusable carrier |
Yoshihiro Tomita |
2018-10-23 |
$21,867,000 |
| 10070520 |
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier |
Yoshihiro Tomita, Shawna M. Liff, Pramod Malatkar |
2018-09-04 |
$19,235,000 |
| 10056182 |
Surface-mount inductor structures for forming one or more inductors with substrate traces |
Gregorio R. Murtagian, Robert L. Sankman, Brent Stone, Kaladhar Radhakrishnan |
2018-08-21 |
$25,621,000 |
| 9991211 |
Semiconductor package having an EMI shielding layer |
Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Ann Jinyan Xu +2 more |
2018-06-05 |
$24,427,000 |
| 9953909 |
Ball grid array (BGA) with anchoring pins |
Zuyang Liang, Michael Garcia, Srikant Nekkanty |
2018-04-24 |
$19,097,000 |
| 9953929 |
Systems and methods for electromagnetic interference shielding |
Rajendra C. Dias, Anna M. Prakash, Eric J. Li, Nachiket R. Raravikar |
2018-04-24 |
$19,097,000 |
| 9847304 |
Electronic device packages with conformal EMI shielding and related methods |
Eric J. Li, Rajendra C. Dias, Mitul Modi |
2017-12-19 |
$19,551,000 |
| 9824901 |
Complex cavity formation in molded packaging structures |
Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff |
2017-11-21 |
$11,290,000 |
| 9795026 |
Electronic package that includes finned vias |
Nayandeep K. Mahanta, Adel A. Elsherbini |
2017-10-17 |
$9,876,000 |
| 9780510 |
Socket contact techniques and configurations |
Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more |
2017-10-03 |
$11,313,000 |
