Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Ken Hackenberg +1 more | 2022-08-02 |
| 10125298 | High thermal conductivity graphite and graphene-containing composites | Alexis Abramson, Ica Manas-Zloczower, Marcio Rodrigo Loos | 2018-11-13 |
| 9795026 | Electronic package that includes finned vias | Joshua D. Heppner, Adel A. Elsherbini | 2017-10-17 |