Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916003 | Varied ball ball-grid-array (BGA) packages | Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander HUETTIS, John Harper +5 more | 2024-02-27 |
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain | 2023-05-16 |
| 11626551 | Bonding ultra-dense bump arrays using alignment bumps | Arnold Daguio, Kwong-Hin Henry Choy, Tigran Nshanian, Paul Scott Martin | 2023-04-11 |
| 11417592 | Methods of utilizing low temperature solder assisted mounting techniques for package structures | Omkar G. Karhade, Sandeep B. Sane | 2022-08-16 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Ken Hackenberg, Nayandeep K. Mahanta +1 more | 2022-08-02 |
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain | 2021-07-13 |
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Eric J. Li | 2020-06-02 |
| 10615128 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Eric J. Li | 2020-04-07 |
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Purushotham Kaushik Muthur Srinath, Pramod Malatkar, Sairam Agraharam, Chandra Mohan Jha, Arnab Choudhury | 2020-03-31 |
| 10586779 | LPS solder paste based low cost fine pitch pop interconnect solutions | James C. Matayabas, Jr., Akshay Mathkar | 2020-03-10 |
| 10515914 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Ken Hackenberg, Vijay Krishnan SUBRAMANIAN, Neha M. Patel | 2019-12-24 |
| 10461007 | Semiconductor package with electromagnetic interference shielding | Rajendra C. Dias | 2019-10-29 |
| 10224299 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Ken Hackenberg, Vijay Krishnan SUBRAMANIAN, Neha M. Patel | 2019-03-05 |
| 10181432 | Computing system with a thermal interface comprising magnetic particles | Ameya Limaye, Shubhada H. Sahasrabudhe | 2019-01-15 |
| 10163810 | Electromagnetic interference shielding for system-in-package technology | Eric J. Li, Yoshihiro Tomita, Robert L. Sankman | 2018-12-25 |
| 9953929 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Eric J. Li | 2018-04-24 |
| 9941652 | Space transformer with perforated metallic plate for electrical die test | James C. Matayabas, Jr., Akshay Mathkar, Dingying Xu | 2018-04-10 |
| 9831206 | LPS solder paste based low cost fine pitch pop interconnect solutions | James C. Matayabas, Jr., Akshay Mathkar | 2017-11-28 |
| 9795038 | Electronic package design that facilitates shipping the electronic package | Omkar G. Karhade, Nitin A. Deshpande | 2017-10-17 |
| 9669425 | Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same | Linda A. Shekhawat | 2017-06-06 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Eric J. Li | 2017-03-28 |
| 9458283 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Gregory S. Constable | 2016-10-04 |
| 9214420 | Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same | Daewoong Suh | 2015-12-15 |
| 9159464 | Thermally and electrically conductive structure comprising a carbon nanotube, a graphite sheet and a metal layer; and method of reducing a contact resistance of same | Linda A. Shekhawat | 2015-10-13 |
| 9068067 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Gregory S. Constable | 2015-06-30 |