Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9028142 | Integrated microelectronic package temperature sensor | Neha M. Patel | 2015-05-12 |
| 8916981 | Epoxy-amine underfill materials for semiconductor packages | Yonghao Xiu, Yiqun Bai, Nisha Ananthakrishnan | 2014-12-23 |
| 8724290 | Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same | Rahul Panat | 2014-05-13 |
| 8586393 | Stress sensor for in-situ measurement of package-induced stress in semiconductor devices | Mohammad M. Farahani, Vladimir Noveski, Neha M. Patel | 2013-11-19 |
| 8569108 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli | 2013-10-29 |
| 8558218 | Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivites and structures formed thereby | Daewoong Suh, Chris Matayabas | 2013-10-15 |
| 8530890 | Aligned nanotube bearing composite material | Ravindra Tanikella | 2013-09-10 |
| 8409665 | Method for reducing contact resistance of a thermally and electrically conductive structure comprising carbon nanotube | Linda A. Shekhawat | 2013-04-02 |
| 8344483 | Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same | Daewoong Suh | 2013-01-01 |
| 8287996 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli | 2012-10-16 |
| 8222750 | Aligned nanotube bearing composite material | Ravindra Tanikella | 2012-07-17 |
| 8174084 | Stress sensor for in-situ measurement of package-induced stress in semiconductor devices | Mohammad M. Farahani, Vladimir Noveski, Neha M. Patel | 2012-05-08 |
| 8158968 | Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivities and structures formed thereby | Daewoong Suh, Chris Matayabas | 2012-04-17 |
| 8133585 | Thermally and electrically conductive structure comprising a carbon nanotube and a carbon coating, and method of reducing a contact resistance of same | Linda A. Shekhawat | 2012-03-13 |
| 8068328 | Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same | Rahul Panat | 2011-11-29 |
| 7799849 | Method to fabricate self-healing material | Nirupama Nirupama | 2010-09-21 |
| 7781260 | Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby | Sandeep B. Sane | 2010-08-24 |
| 7713858 | Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same | Daewoong Suh | 2010-05-11 |
| 7700943 | In-situ functionalization of carbon nanotubes | James C. Matayabas, Jr. | 2010-04-20 |
| 7666768 | Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance | Daewoong Suh, Leonel Arana, James C. Matayabas, Jr. | 2010-02-23 |
| 7618679 | Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same | Linda A. Shekhawat | 2009-11-17 |
| 7553681 | Carbon nanotube-based stress sensor | Neha M. Patel | 2009-06-30 |
| 7534648 | Aligned nanotube bearing composite material | Ravindra Tanikella | 2009-05-19 |
| 7465605 | In-situ functionalization of carbon nanotubes | James C. Matayabas, Jr. | 2008-12-16 |
| 7371674 | Nanostructure-based package interconnect | Daewoong Suh | 2008-05-13 |