Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037941 | Integrated device package comprising photo sensitive fill between a substrate and a die | Milind Shah, Rajneesh Kumar | 2018-07-31 |
| 9806063 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Chin-Kwan Kim, Rajneesh Kumar, Jie Fu, Ahmer Syed, Milind Shah +1 more | 2017-10-31 |
| 9258880 | Package substrate and die spacer layers having a ceramic backbone | Aleksandar Aleksov, Sujit Sharan, Shankar Ganapathysubramanian | 2016-02-09 |
| 8604353 | Package substrate and die spacer layers having a ceramic backbone | Aleksandar Aleksov, Sujit Sharan, Shankar Ganapathysubramanian | 2013-12-10 |
| 8586393 | Stress sensor for in-situ measurement of package-induced stress in semiconductor devices | Mohammad M. Farahani, Neha M. Patel, Nachiket R. Raravikar | 2013-11-19 |
| 8414677 | Dense, shaped articles constructed of a refractory material and methods of preparing such articles | Raoul Schlesser, Rafael Dalmau, Zlatko Sitar | 2013-04-09 |
| 8186051 | Method for fabricating package substrate and die spacer layers having a ceramic backbone | Aleksandar Aleksov, Sujit Sharan, Shankar Ganapathysubramanian | 2012-05-29 |
| 8174084 | Stress sensor for in-situ measurement of package-induced stress in semiconductor devices | Mohammad M. Farahani, Neha M. Patel, Nachiket R. Raravikar | 2012-05-08 |
| 7678195 | Seeded growth process for preparing aluminum nitride single crystals | Raoul Schlesser, Zlatko Sitar | 2010-03-16 |
| 7632454 | Dense, shaped articles constructed of a refractory material and methods of preparing such articles | Raoul Schlesser, Rafael Dalmau, Zlatko Sitar | 2009-12-15 |