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Integrated device package comprising photo sensitive fill between a substrate and a die |
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Package substrate and die spacer layers having a ceramic backbone |
Aleksandar Aleksov, Sujit Sharan, Shankar Ganapathysubramanian |
2016-02-09 |
| 8604353 |
Package substrate and die spacer layers having a ceramic backbone |
Aleksandar Aleksov, Sujit Sharan, Shankar Ganapathysubramanian |
2013-12-10 |
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Stress sensor for in-situ measurement of package-induced stress in semiconductor devices |
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2013-11-19 |
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Dense, shaped articles constructed of a refractory material and methods of preparing such articles |
Raoul Schlesser, Rafael Dalmau, Zlatko Sitar |
2013-04-09 |
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Method for fabricating package substrate and die spacer layers having a ceramic backbone |
Aleksandar Aleksov, Sujit Sharan, Shankar Ganapathysubramanian |
2012-05-29 |
| 8174084 |
Stress sensor for in-situ measurement of package-induced stress in semiconductor devices |
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2012-05-08 |
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Seeded growth process for preparing aluminum nitride single crystals |
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2010-03-16 |
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Dense, shaped articles constructed of a refractory material and methods of preparing such articles |
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2009-12-15 |