Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300655 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Periannan Chidambaram, Abdolreza Langari | 2025-05-13 |
| 12046545 | Hybrid reconstituted substrate for electronic packaging | Jonghae Kim, Periannan Chidambaram | 2024-07-23 |
| 11894366 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Periannan Chidambaram | 2024-02-06 |
| 11817379 | Substrate comprising an inductor and a capacitor located in an encapsulation layer | Jonghae Kim, Periannan Chidambaram | 2023-11-14 |
| 11776888 | Package with a substrate comprising protruding pad interconnects | Kuiwon Kang, Hong Bok We, Chin-Kwan Kim | 2023-10-03 |
| 11764489 | Sub-module L-shaped millimeter wave antenna-in-package | Chin-Kwan Kim, Jaehyun Yeon, Rajneesh Kumar, Suhyung Hwang | 2023-09-19 |
| 11689181 | Package comprising stacked filters with a shared substrate cap | Jonghae Kim, Je-Hsiung Lan, Ranadeep Dutta, Periannan Chidambaram | 2023-06-27 |
| 11670614 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Periannan Chidambaram, Abdolreza Langari | 2023-06-06 |
| 11652101 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Periannan Chidambaram | 2023-05-16 |
| 11417637 | Stacked decoupling capacitors with integration in a substrate | Jonghae Kim, Periannan Chidambaram | 2022-08-16 |
| 11320847 | Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabrication | Jonghae Kim, Ravindra V. Shenoy, Evgeni Gousev, Periannan Chidambaram | 2022-05-03 |
| 11296670 | Impedance matching transceiver | Jonghae Kim, Periannan Chidambaram | 2022-04-05 |
| 11239573 | Sub-module L-shaped millimeter wave antenna-in-package | Chin-Kwan Kim, Jaehyun Yeon, Rajneesh Kumar, Suhyung Hwang | 2022-02-01 |
| 11201127 | Device comprising contact to contact coupling of packages | Jonghae Kim, Periannan Chidambaram | 2021-12-14 |
| 11189686 | Integrated device coupled to a capacitor structure comprising a trench capacitor | Jonghae Kim, Periannan Chidambaram | 2021-11-30 |
| 11101228 | Integrated circuit package with a magnetic core | Jonghae Kim, Periannan Chidambaram | 2021-08-24 |
| 10510733 | Integrated device comprising embedded package on package (PoP) device | Rajneesh Kumar, Chin-Kwan Kim | 2019-12-17 |
| 10163871 | Integrated device comprising embedded package on package (PoP) device | Rajneesh Kumar, Chin-Kwan Kim | 2018-12-25 |
| 10037941 | Integrated device package comprising photo sensitive fill between a substrate and a die | Vladimir Noveski, Rajneesh Kumar | 2018-07-31 |
| 9806063 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Chin-Kwan Kim, Rajneesh Kumar, Vladimir Noveski, Jie Fu, Ahmer Syed +1 more | 2017-10-31 |
| 9768108 | Conductive post protection for integrated circuit packages | Jie Fu, Chin-Kwan Kim, Manuel Aldrete, Dwayne Richard Shirley | 2017-09-19 |
| 9601435 | Semiconductor package with embedded components and method of making the same | Chin-Kwan Kim, David Fraser Rae, Rajneesh Kumar, Omar J. Bchir | 2017-03-21 |
| 9484327 | Package-on-package structure with reduced height | Chin-Kwan Kim, Omar J. Bchir, Marcus HSU, David Fraser Rae | 2016-11-01 |
| 9466578 | Substrate comprising improved via pad placement in bump area | Jie Fu, Manuel Aldrete | 2016-10-11 |
| 9379090 | System, apparatus, and method for split die interconnection | Ahmer Syed, Chin-Kwan Kim, Omar J. Bchir, Ryan David Lane | 2016-06-28 |