| 12300655 |
Integrated circuit assembly with hybrid bonding |
Jonghae Kim, Milind Shah, Periannan Chidambaram |
2025-05-13 |
| 11670614 |
Integrated circuit assembly with hybrid bonding |
Jonghae Kim, Milind Shah, Periannan Chidambaram |
2023-06-06 |
| 11437307 |
Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction |
Yuan LI, Shrestha Ganguly, Terence Cheung, Ching-Liou Huang, Hui Wang |
2022-09-06 |
| 10916494 |
Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction |
Yuan LI, Shrestha Ganguly, Terence Cheung, Ching-Liou Huang, Hui Wang |
2021-02-09 |
| 6848500 |
Cooling system for pulsed power electronics |
Seyed H. Hashemi |
2005-02-01 |
| 6586847 |
Method and structure for temperature stabilization in semiconductor devices |
Surasit Chungpaiboonpatana, Seyed H. Hashemi |
2003-07-01 |
| 6359343 |
Temperature stabilization in flip chip technology |
Seyed H. Hashemi |
2002-03-19 |
| 6261871 |
Method and structure for temperature stabilization in flip chip technology |
Seyed H. Hashemi |
2001-07-17 |
| 6134110 |
Cooling system for power amplifier and communication system employing the same |
— |
2000-10-17 |