| 12424518 |
Capacitor embedded 3D resonator for broadband filter |
Je-Hsiung Lan, Kai Liu, Ranadeep Dutta |
2025-09-23 |
|
| 12400966 |
Package comprising integrated devices and bridge coupling top sides of integrated devices |
Bharani Chava, Abinash ROY, Stanley Seungchul Song |
2025-08-26 |
|
| 12395152 |
Compact hybrid acoustic wave filter structure |
Je-Hsiung Lan, Nosun PARK, Jui-Yi Chiu, Kai Liu |
2025-08-19 |
|
| 12354948 |
Integrated device and integrated passive device comprising magnetic material |
Kai Liu, Roy Chiu, Nosun PARK, Je-Hsiung Lan |
2025-07-08 |
|
| 12334903 |
Substrate comprising acoustic resonators configured as at least one acoustic filter |
Je-Hsiung Lan, Ranadeep Dutta |
2025-06-17 |
|
| 12300655 |
Integrated circuit assembly with hybrid bonding |
Milind Shah, Periannan Chidambaram, Abdolreza Langari |
2025-05-13 |
|
| 12283607 |
3D inductor design using bundle substrate vias |
Je-Hsiung Lan, Ranadeep Dutta |
2025-04-22 |
|
| 12273095 |
Wideband filter with resonators and inductors |
Kai Liu, Rui Tang, Changhan Hobie Yun, Mario Francisco Velez |
2025-04-08 |
|
| 12253885 |
Electronic device including flexible display |
Joungmin CHO, Sungdae CHOI, Kwangtai KIM, Donghyun YEOM |
2025-03-18 |
|
| 12255381 |
Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods |
Ranadeep Dutta, Je-Hsiung Lan |
2025-03-18 |
|
| 12218041 |
Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods |
Jihong Choi, Giridhar Nallapati, William Stone, Jianwen Xu, Periannan Chidambaram +1 more |
2025-02-04 |
|
| 12206155 |
Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit package |
Kai Liu, Jui-Yi Chiu, Nosun PARK, Je-Hsiung Lan |
2025-01-21 |
|
| 12155373 |
Backend and acoustic process integration for high-Q filter |
Kai Liu, Je-Hsiung Lan |
2024-11-26 |
$20,218,000 |
| 12153466 |
Support member supporting slidable display and electronic device including the same |
— |
2024-11-26 |
|
| 12142561 |
Integrated device and integrated passive device comprising magnetic material |
Kai Liu, Je-Hsiung Lan |
2024-11-12 |
$23,398,000 |
| 12046545 |
Hybrid reconstituted substrate for electronic packaging |
Milind Shah, Periannan Chidambaram |
2024-07-23 |
$12,759,000 |
| 12046530 |
Thermal bridge interposer structure |
Je-Hsiung Lan, Ranadeep Dutta |
2024-07-23 |
$12,759,000 |
| 12040268 |
Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter design |
Je-Hsiung Lan, Kai Liu, Nosun PARK |
2024-07-16 |
$20,876,000 |
| 12007808 |
Foldable electronic device |
Myeongsil PARK, Joohoon Lee, Seonghoon KIM |
2024-06-11 |
|
| 11984874 |
Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods |
Ranadeep Dutta, Je-Hsiung Lan |
2024-05-14 |
$21,127,000 |
| 11960321 |
Foldable electronic device comprising integrated-adhesive layer and adhesion prevention part |
Seonghoon KIM, Sungho AHN, Kwangtai KIM, Donghyun YEOM |
2024-04-16 |
|
| 11894366 |
Trench capacitor assembly for high capacitance density |
Milind Shah, Periannan Chidambaram |
2024-02-06 |
$12,962,000 |
| 11876085 |
Package with a substrate comprising an embedded capacitor with side wall coupling |
Abinash ROY, Lohith Kumar Vemula, Bharani Chava |
2024-01-16 |
$18,030,000 |
| 11862367 |
ESL-less AC resistor for high frequency applications |
Sang-June Park, Je-Hsiung Lan, Ranadeep Dutta |
2024-01-02 |
$10,990,000 |
| 11830819 |
Package comprising integrated devices and bridge coupling top sides of integrated devices |
Bharani Chava, Abinash ROY, Stanley Seungchul Song |
2023-11-28 |
$9,697,000 |
