Issued Patents All Time
Showing 25 most recent of 241 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424518 | Capacitor embedded 3D resonator for broadband filter | Je-Hsiung Lan, Kai Liu, Ranadeep Dutta | 2025-09-23 |
| 12400966 | Package comprising integrated devices and bridge coupling top sides of integrated devices | Bharani Chava, Abinash ROY, Stanley Seungchul Song | 2025-08-26 |
| 12395152 | Compact hybrid acoustic wave filter structure | Je-Hsiung Lan, Nosun PARK, Jui-Yi Chiu, Kai Liu | 2025-08-19 |
| 12354948 | Integrated device and integrated passive device comprising magnetic material | Kai Liu, Roy Chiu, Nosun PARK, Je-Hsiung Lan | 2025-07-08 |
| 12334903 | Substrate comprising acoustic resonators configured as at least one acoustic filter | Je-Hsiung Lan, Ranadeep Dutta | 2025-06-17 |
| 12300655 | Integrated circuit assembly with hybrid bonding | Milind Shah, Periannan Chidambaram, Abdolreza Langari | 2025-05-13 |
| 12283607 | 3D inductor design using bundle substrate vias | Je-Hsiung Lan, Ranadeep Dutta | 2025-04-22 |
| 12273095 | Wideband filter with resonators and inductors | Kai Liu, Rui Tang, Changhan Hobie Yun, Mario Francisco Velez | 2025-04-08 |
| 12253885 | Electronic device including flexible display | Joungmin CHO, Sungdae CHOI, Kwangtai KIM, Donghyun YEOM | 2025-03-18 |
| 12255381 | Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods | Ranadeep Dutta, Je-Hsiung Lan | 2025-03-18 |
| 12218041 | Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods | Jihong Choi, Giridhar Nallapati, William Stone, Jianwen Xu, Periannan Chidambaram +1 more | 2025-02-04 |
| 12206155 | Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit package | Kai Liu, Jui-Yi Chiu, Nosun PARK, Je-Hsiung Lan | 2025-01-21 |
| 12155373 | Backend and acoustic process integration for high-Q filter | Kai Liu, Je-Hsiung Lan | 2024-11-26 |
| 12153466 | Support member supporting slidable display and electronic device including the same | — | 2024-11-26 |
| 12142561 | Integrated device and integrated passive device comprising magnetic material | Kai Liu, Je-Hsiung Lan | 2024-11-12 |
| 12046545 | Hybrid reconstituted substrate for electronic packaging | Milind Shah, Periannan Chidambaram | 2024-07-23 |
| 12046530 | Thermal bridge interposer structure | Je-Hsiung Lan, Ranadeep Dutta | 2024-07-23 |
| 12040268 | Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter design | Je-Hsiung Lan, Kai Liu, Nosun PARK | 2024-07-16 |
| 12007808 | Foldable electronic device | Myeongsil PARK, Joohoon Lee, Seonghoon KIM | 2024-06-11 |
| 11984874 | Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods | Ranadeep Dutta, Je-Hsiung Lan | 2024-05-14 |
| 11960321 | Foldable electronic device comprising integrated-adhesive layer and adhesion prevention part | Seonghoon KIM, Sungho AHN, Kwangtai KIM, Donghyun YEOM | 2024-04-16 |
| 11894366 | Trench capacitor assembly for high capacitance density | Milind Shah, Periannan Chidambaram | 2024-02-06 |
| 11876085 | Package with a substrate comprising an embedded capacitor with side wall coupling | Abinash ROY, Lohith Kumar Vemula, Bharani Chava | 2024-01-16 |
| 11862367 | ESL-less AC resistor for high frequency applications | Sang-June Park, Je-Hsiung Lan, Ranadeep Dutta | 2024-01-02 |
| 11830819 | Package comprising integrated devices and bridge coupling top sides of integrated devices | Bharani Chava, Abinash ROY, Stanley Seungchul Song | 2023-11-28 |