| 12400966 |
Package comprising integrated devices and bridge coupling top sides of integrated devices |
Abinash ROY, Stanley Seungchul Song, Jonghae Kim |
2025-08-26 |
| 12057436 |
Package comprising an integrated device configured for shareable power resource |
Abinash ROY |
2024-08-06 |
| 11876085 |
Package with a substrate comprising an embedded capacitor with side wall coupling |
Abinash ROY, Lohith Kumar Vemula, Jonghae Kim |
2024-01-16 |
| 11830819 |
Package comprising integrated devices and bridge coupling top sides of integrated devices |
Abinash ROY, Stanley Seungchul Song, Jonghae Kim |
2023-11-28 |
| 11764186 |
Package comprising an integrated device configured for shareable power resource |
Abinash ROY |
2023-09-19 |
| 11749327 |
Memory bit cell circuit including a bit line coupled to a static random-access memory (SRAM) bit cell circuit and a non-volatile memory (NVM) bit cell circuit and a memory bit cell array circuit |
Khaja Ahmad Shaik |
2023-09-05 |
| 11710733 |
Vertical power grid standard cell architecture |
Hyeokjin Lim, Foua Vang, Seung H. Kang, Venugopal Boynapalli |
2023-07-25 |
| 11668735 |
Granular sensing on an integrated circuit |
Stefano Facchin, Baptiste Grave, David Jonathan Walshe |
2023-06-06 |
| 11645503 |
Multibit neural network |
Mohit Gupta, Wim Dehaene, Sushil Sakhare |
2023-05-09 |
| 11552055 |
Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methods |
Stanley Seungchul Song |
2023-01-10 |
| 11515289 |
Stacked die integrated with package voltage regulators |
Stanley Seungchul Song, Abinash ROY, Jonghae Kim |
2022-11-29 |
| 11449740 |
Synapse circuit with memory |
Shairfe Muhammad Salahuddin, Hyungrock Oh |
2022-09-20 |
| 11437379 |
Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits |
Stanley Seungchul Song, Deepak Sharma, Hyeokjin Lim, Peijie Feng, Seung H. Kang +6 more |
2022-09-06 |
| 11430797 |
Package embedded programmable resistor for voltage droop mitigation |
Abinash ROY |
2022-08-30 |
| 11270991 |
Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS) BEOL (BS-BEOL) power routing for current flow organization, and related methods |
Stanley Seungchul Song, Mohammed Yousuff Shariff |
2022-03-08 |
| 11195793 |
Metal filling in a dielectric layer under metal layer one (M1)and above an active device layer in semiconductor devices |
Stanley Seungchul Song |
2021-12-07 |
| 11176991 |
Compute-in-memory (CIM) employing low-power CIM circuits employing static random access memory (SRAM) bit cells, particularly for multiply-and-accumluate (MAC) operations |
Khaja Ahmad Shaik, Dawuth Shadulkhan Pathan |
2021-11-16 |