Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218041 | Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods | Jihong Choi, Giridhar Nallapati, William Stone, Jonghae Kim, Periannan Chidambaram +1 more | 2025-02-04 |
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Li-Sheng Weng, Charles David Paynter, Ryan David Lane, William Stone | 2023-10-10 |
| 10752614 | Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and peg-co-polycarbonate hydrogels | Jie Song | 2020-08-25 |
| 10141202 | Semiconductor device comprising mold for top side and sidewall protection | Reynante Tamunan Alvarado, Lizabeth Keser | 2018-11-27 |
| 9908871 | Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogels | Jie Song | 2018-03-06 |
| 9388276 | Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogels | Jie Song | 2016-07-12 |
| 9318405 | Wafer level package without sidewall cracking | Lizabeth Keser, William Stone, Steve Joseph Bezuk, Nicholas Yu | 2016-04-19 |
| 9259509 | Thermal responsive polymer siloxanes, compositions, and method and applications related thereto | Jie Song | 2016-02-16 |
| 9054111 | Electronic device and method of packaging an electronic device | Lizabeth Keser, Goerge R. Leal, Betty Hill-Shan Yeung | 2015-06-09 |
| 9034697 | Apparatus and methods for quad flat no lead packaging | Zhiwei Gong, Wei Gao, Scott M. Hayes | 2015-05-19 |
| 8841168 | Soldering relief method and semiconductor device employing same | Mark Wendell Schwarz | 2014-09-23 |
| 8765112 | Thermal responsive polymer siloxanes, compositions, and method and applications related thereto | Jie Song | 2014-07-01 |
| 8617935 | Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages | Zhiwei Gong, Scott M. Hayes | 2013-12-31 |
| 8609471 | Packaging an integrated circuit die using compression molding | — | 2013-12-17 |
| 8597630 | Thermal-responsive polymer networks, compositions, and methods and applications related thereto | Jie Song | 2013-12-03 |
| 8461676 | Soldering relief method and semiconductor device employing same | Mark Wendell Schwarz | 2013-06-11 |
| 8327532 | Method for releasing a microelectronic assembly from a carrier substrate | Scott M. Hayes, William H. Lytle | 2012-12-11 |
| 8236609 | Packaging an integrated circuit die with backside metallization | Lakshmi N. Ramanathan, Craig Amrine | 2012-08-07 |
| 8216918 | Method of forming a packaged semiconductor device | Zhiwei Gong, Scott M. Hayes, George R. Leal, Douglas G. Mitchell, Jason Wright | 2012-07-10 |
| 7595226 | Method of packaging an integrated circuit die | William H. Lytle, Owen R. Fay | 2009-09-29 |
| 6864306 | High dielectric polymer composites and methods of preparation thereof | Yang Rao, Ching-Ping Wong | 2005-03-08 |