Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243855 | Package comprising channel interconnects located between solder interconnects | Aniket PATIL, Durodami LISK, Hong Bok We | 2025-03-04 |
| 12160952 | Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods | Biancun Xie, Shree Krishna Pandey, Chin-Kwan Kim, Ryan David Lane | 2024-12-03 |
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Li-Sheng Weng, Ryan David Lane, Jianwen Xu, William Stone | 2023-10-10 |
| 11605594 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate | Ryan David Lane, Li-Sheng Weng, Eric David Foronda | 2023-03-14 |
| 11452246 | Patch substrate configured as a shield located over a cavity of a board | Ryan David Lane, John Eaton, Amit Mano | 2022-09-20 |
| 10321575 | Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components | Yue Li, Ryan David Lane, Ruey Kae Zang | 2019-06-11 |
| 10231324 | Staggered power structure in a power distribution network (PDN) | Ryan David Lane, Yue Li, Ruey Kae Zang | 2019-03-12 |
| 10170232 | Toroid inductor with reduced electromagnetic field leakage | Yue Li, Ryan David Lane | 2019-01-01 |
| 10008316 | Inductor embedded in a package substrate | Siamak Fazelpour, Ryan David Lane | 2018-06-26 |
| 9871012 | Method and apparatus for routing die signals using external interconnects | Vaishnav Srinivas, Bernie Jord Yang, Michael Brunolli, David Ian West | 2018-01-16 |
| 9514966 | Apparatus and methods for shielding differential signal pin pairs | Siamak Fazelpour, Ryan David Lane | 2016-12-06 |
| 9484281 | Systems and methods for thermal dissipation | Ryan David Lane | 2016-11-01 |
| 9263186 | DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor | Yue Li, Xiaoming Chen, Zhongping Bao, Xiaonan Zhang, Ryan David Lane | 2016-02-16 |
| 9153560 | Package on package (PoP) integrated device comprising a redistribution layer | Ryan David Lane, David Ian West | 2015-10-06 |
| 9041176 | Hybrid semiconductor module structure | Yue Li, Ruey Kae Zang | 2015-05-26 |