| 12243855 |
Package comprising channel interconnects located between solder interconnects |
Aniket PATIL, Durodami LISK, Hong Bok We |
2025-03-04 |
| 12160952 |
Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods |
Biancun Xie, Shree Krishna Pandey, Chin-Kwan Kim, Ryan David Lane |
2024-12-03 |
| 11784157 |
Package comprising integrated devices coupled through a metallization layer |
Li-Sheng Weng, Ryan David Lane, Jianwen Xu, William Stone |
2023-10-10 |
| 11605594 |
Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate |
Ryan David Lane, Li-Sheng Weng, Eric David Foronda |
2023-03-14 |
| 11452246 |
Patch substrate configured as a shield located over a cavity of a board |
Ryan David Lane, John Eaton, Amit Mano |
2022-09-20 |
| 10321575 |
Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components |
Yue Li, Ryan David Lane, Ruey Kae Zang |
2019-06-11 |
| 10231324 |
Staggered power structure in a power distribution network (PDN) |
Ryan David Lane, Yue Li, Ruey Kae Zang |
2019-03-12 |
| 10170232 |
Toroid inductor with reduced electromagnetic field leakage |
Yue Li, Ryan David Lane |
2019-01-01 |
| 10008316 |
Inductor embedded in a package substrate |
Siamak Fazelpour, Ryan David Lane |
2018-06-26 |
| 9871012 |
Method and apparatus for routing die signals using external interconnects |
Vaishnav Srinivas, Bernie Jord Yang, Michael Brunolli, David Ian West |
2018-01-16 |
| 9514966 |
Apparatus and methods for shielding differential signal pin pairs |
Siamak Fazelpour, Ryan David Lane |
2016-12-06 |
| 9484281 |
Systems and methods for thermal dissipation |
Ryan David Lane |
2016-11-01 |
| 9263186 |
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor |
Yue Li, Xiaoming Chen, Zhongping Bao, Xiaonan Zhang, Ryan David Lane |
2016-02-16 |
| 9153560 |
Package on package (PoP) integrated device comprising a redistribution layer |
Ryan David Lane, David Ian West |
2015-10-06 |
| 9041176 |
Hybrid semiconductor module structure |
Yue Li, Ruey Kae Zang |
2015-05-26 |