Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354935 | Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods | Kuiwon Kang, Joonsuk Park | 2025-07-08 |
| 12300873 | Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods | Suhyung Hwang, Kun Fang, Jaehyun Yeon, Taesik Yang | 2025-05-13 |
| 12293980 | Package comprising discrete antenna device | Jaehyun Yeon, Suhyung Hwang, Rajneesh Kumar, Darryl Sheldon JESSIE | 2025-05-06 |
| 12160952 | Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods | Biancun Xie, Shree Krishna Pandey, Ryan David Lane, Charles David Paynter | 2024-12-03 |
| 11776888 | Package with a substrate comprising protruding pad interconnects | Kuiwon Kang, Hong Bok We, Milind Shah | 2023-10-03 |
| 11764489 | Sub-module L-shaped millimeter wave antenna-in-package | Milind Shah, Jaehyun Yeon, Rajneesh Kumar, Suhyung Hwang | 2023-09-19 |
| 11756894 | Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods | Jeahyeong Han, Rajneesh Kumar, Jeongil Jay Kim | 2023-09-12 |
| 11637057 | Uniform via pad structure having covered traces between partially covered pads | Kuiwon Kang, Aniket PATIL, Jaehyun Yeon | 2023-04-25 |
| 11258165 | Asymmetric antenna structure | Hong Bok We, Jaehyun Yeon, Suhyung Hwang | 2022-02-22 |
| 11239573 | Sub-module L-shaped millimeter wave antenna-in-package | Milind Shah, Jaehyun Yeon, Rajneesh Kumar, Suhyung Hwang | 2022-02-01 |
| 11075260 | Substrate comprising recessed interconnects and a surface mounted passive component | Kuiwon Kang, Hong Bok We, Jaehyun Yeon | 2021-07-27 |
| 11043740 | Enhanced antenna module with shield layer | Suhyung Hwang, Hong Bok We, Jaehyun Yeon | 2021-06-22 |
| 10734332 | High aspect ratio interconnects in air gap of antenna package | Jon Bradley Lasiter, Ravindra V. Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Vladimir Aparin +4 more | 2020-08-04 |
| 10510733 | Integrated device comprising embedded package on package (PoP) device | Rajneesh Kumar, Milind Shah | 2019-12-17 |
| 10431511 | Power amplifier with RF structure | Daeik Daniel Kim, Shu Zhang, Bonhoon Koo, Manuel Aldrete, Jie Fu +2 more | 2019-10-01 |
| 10410971 | Thermal and electromagnetic interference shielding for die embedded in package substrate | David Fraser Rae, Hong Bok We, Christopher J. Healy | 2019-09-10 |
| 10403707 | Array type inductor | Hong Bok We, Joonsuk Park | 2019-09-03 |
| 10325855 | Backside drill embedded die substrate | Daeik Daniel Kim, Jie Fu, Changhan Hobie Yun, Manuel Aldrete, Chengjie Zuo +2 more | 2019-06-18 |
| 10163871 | Integrated device comprising embedded package on package (PoP) device | Rajneesh Kumar, Milind Shah | 2018-12-25 |
| 9947642 | Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages | Rajneesh Kumar, Brian Roggeman | 2018-04-17 |
| 9806063 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Rajneesh Kumar, Vladimir Noveski, Jie Fu, Ahmer Syed, Milind Shah +1 more | 2017-10-31 |
| 9768108 | Conductive post protection for integrated circuit packages | Jie Fu, Manuel Aldrete, Milind Shah, Dwayne Richard Shirley | 2017-09-19 |
| 9679841 | Substrate and method of forming the same | Houssam Jomaa, Omar J. Bchir, Kuiwon Kang | 2017-06-13 |
| 9642259 | Embedded bridge structure in a substrate | Omar J. Bchir, Dong Wook Kim, Hong Bok We | 2017-05-02 |
| 9609751 | Package substrate comprising surface interconnect and cavity comprising electroless fill | Houssam Jomaa, Omar J. Bchir | 2017-03-28 |