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Coupling of integrated circuits (ICS) through a passivation-defined contact pad |
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2022-09-20 |
| 10410971 |
Thermal and electromagnetic interference shielding for die embedded in package substrate |
David Fraser Rae, Hong Bok We, Chin-Kwan Kim |
2019-09-10 |
| 10002857 |
Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer |
Michael James Solimando, William Stone, John Holmes, Rajendra D. Pendse, Sun Hyuck Yun |
2018-06-19 |
| 9313881 |
Through mold via relief gutter on molded laser package (MLP) packages |
Gopal C. Jha, Manuel Aldrete |
2016-04-12 |
| 8753926 |
Electronic packaging with a variable thickness mold cap |
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2014-06-17 |
| 8546921 |
Hybrid multilayer substrate |
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2013-10-01 |
| 8371497 |
Method for manufacturing tight pitch, flip chip integrated circuit packages |
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2013-02-12 |