Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9313881 | Through mold via relief gutter on molded laser package (MLP) packages | Christopher J. Healy, Manuel Aldrete | 2016-04-12 |
| 8753926 | Electronic packaging with a variable thickness mold cap | Christopher J. Healy, Vivek Ramadoss | 2014-06-17 |
| 8546921 | Hybrid multilayer substrate | Vivek Ramadoss, Christopher J. Healy | 2013-10-01 |