| 11804428 |
Mixed pad size and pad design |
Wen Yin, Yonghao An |
2023-10-31 |
| 10879191 |
Conformal shielding for solder ball array |
Daniel Daeik Kim, Babak Nejati |
2020-12-29 |
| 10511268 |
Segmented thermal and RF ground |
Daeik Daniel Kim, Bonhoon Koo |
2019-12-17 |
| 10490472 |
Air cavity mold |
Jie Fu, Hong Bok We |
2019-11-26 |
| 10431511 |
Power amplifier with RF structure |
Daeik Daniel Kim, Shu Zhang, Bonhoon Koo, Jie Fu, Chin-Kwan Kim +2 more |
2019-10-01 |
| 10418333 |
Waveguide along shielded side wall |
Daeik Daniel Kim, Jie Fu |
2019-09-17 |
| 10325859 |
Shielded stacked substrate apparatus and method of fabricating |
Daeik Daniel Kim, Jie Fu |
2019-06-18 |
| 10325855 |
Backside drill embedded die substrate |
Daeik Daniel Kim, Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Chengjie Zuo +2 more |
2019-06-18 |
| 10319694 |
Semiconductor assembly and method of making same |
Daniel Daeik Kim, Jie Fu, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy +2 more |
2019-06-11 |
| 9768108 |
Conductive post protection for integrated circuit packages |
Jie Fu, Chin-Kwan Kim, Milind Shah, Dwayne Richard Shirley |
2017-09-19 |
| 9466578 |
Substrate comprising improved via pad placement in bump area |
Jie Fu, Milind Shah |
2016-10-11 |
| 9313881 |
Through mold via relief gutter on molded laser package (MLP) packages |
Christopher J. Healy, Gopal C. Jha |
2016-04-12 |
| 9269681 |
Surface finish on trace for a thermal compression flip chip (TCFC) |
Houssam Jomaa, Omar J. Bchir, Milind Shah, Chin-Kwan Kim |
2016-02-23 |
| 8802556 |
Barrier layer on bump and non-wettable coating on trace |
Omar J. Bchir, Milind Shah, Houssam Jomaa, Chin-Kwan Kim |
2014-08-12 |