DK

Daniel Daeik Kim

QU Qualcomm: 14 patents #1,516 of 12,104Top 15%
RP Rf360 Singapore Pte.: 1 patents #47 of 118Top 40%
Overall (All Time): #309,924 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12402332 Integrated passive devices Changhan Hobie Yun, Nosun PARK, Paragkumar Ajaybhai Thadesar, Sameer S. Vadhavkar, Vinay Prakash 2025-08-26
12016247 Package comprising an integrated passive device configured as a cap for a filter Changhan Hobie Yun, Nosun PARK, Paragkumar Ajaybhai Thadesar, Sameer S. Vadhavkar 2024-06-18
12009292 Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation Nosun PARK, Changhan Hobie Yun, Paragkumar Ajaybhai Thadesar, Sameer S. Vadhavkar 2024-06-11
11817239 Embedded vertical inductor in laminate stacked substrates Bonhoon Koo, Babak Nejati 2023-11-14
11770115 Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methods Changhan Hobie Yun, Hannu Laurila, Ville Lehtisalo, Ville Herman Brunou, Paragkumar Ajaybhai Thadesar +2 more 2023-09-26
11728293 Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component Changhan Hobie Yun, Paragkumar Ajaybhai Thadesar, Nosun PARK, Sameer S. Vadhavkar 2023-08-15
11658403 Device, package and/or substrate comprising curved antenna Changhan Hobie Yun, Paragkumar Ajaybhai Thadesar, Nosun PARK, Sameer S. Vadhavkar 2023-05-23
11515247 Capacitance fine tuning by fin capacitor design Nosun PARK, Changhan Hobie Yun, Sameer S. Vadhavkar, Paragkumar Ajaybhai Thadesar 2022-11-29
11502652 Substrate comprising capacitor configured for power amplifier output match Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Sameer S. Vadhavkar, Nosun PARK 2022-11-15
11380471 RF damping structure in inductive device Bonhoon Koo, Babak Nejati 2022-07-05
11239158 Wire bond inductor structures for flip chip dies Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Sameer S. Vadhavkar, Francesco Carrara 2022-02-01
11011461 Perpendicular inductors integrated in a substrate Shu Zhang, Chenqian Gan, Bonhoon Koo, Babak Nejati 2021-05-18
10903240 Integrated circuits (ICs) on a glass substrate Shiqun Gu, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more 2021-01-26
10879191 Conformal shielding for solder ball array Manuel Aldrete, Babak Nejati 2020-12-29
10319694 Semiconductor assembly and method of making same Jie Fu, Manuel Aldrete, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy +2 more 2019-06-11