| 12402332 |
Integrated passive devices |
Changhan Hobie Yun, Nosun PARK, Paragkumar Ajaybhai Thadesar, Daniel Daeik Kim, Vinay Prakash |
2025-08-26 |
|
| 12016247 |
Package comprising an integrated passive device configured as a cap for a filter |
Changhan Hobie Yun, Nosun PARK, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar |
2024-06-18 |
$32,123,000 |
| 12009292 |
Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation |
Nosun PARK, Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar |
2024-06-11 |
$20,939,000 |
| 11929456 |
Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods |
— |
2024-03-12 |
|
| 11776877 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths |
Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more |
2023-10-03 |
$10,230,000 |
| 11735549 |
Methods and systems for manufacturing pillar structures on semiconductor devices |
Suresh Yeruva, Owen R. Fay, Adriel Jebin Jacob Jebaraj, Wayne H. Huang |
2023-08-22 |
$9,108,000 |
| 11728293 |
Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component |
Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Nosun PARK |
2023-08-15 |
$7,580,000 |
| 11658403 |
Device, package and/or substrate comprising curved antenna |
Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Nosun PARK |
2023-05-23 |
$8,812,000 |
| 11631630 |
Pillar-last methods for forming semiconductor devices |
Anilkumar Chandolu, Wayne H. Huang |
2023-04-18 |
$17,530,000 |
| 11515247 |
Capacitance fine tuning by fin capacitor design |
Nosun PARK, Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar |
2022-11-29 |
$17,374,000 |
| 11502652 |
Substrate comprising capacitor configured for power amplifier output match |
Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Nosun PARK |
2022-11-15 |
$20,223,000 |
| 11239158 |
Wire bond inductor structures for flip chip dies |
Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Daniel Daeik Kim, Francesco Carrara |
2022-02-01 |
$28,075,000 |
| 11139258 |
Bonding pads with thermal pathways |
Jaspreet S. Gandhi, James M. Derderian, Jian Li |
2021-10-05 |
$16,233,000 |
| 11081460 |
Methods and systems for manufacturing pillar structures on semiconductor devices |
Suresh Yeruva, Owen R. Fay, Adriel Jebin Jacob Jebaraj, Wayne H. Huang |
2021-08-03 |
$20,873,000 |
| 10957625 |
Pillar-last methods for forming semiconductor devices |
Anilkumar Chandolu, Wayne H. Huang |
2021-03-23 |
$19,320,000 |
| 10916527 |
Apparatuses and methods for semiconductor die heat dissipation |
Xiao Li, Anilkumar Chandolu |
2021-02-09 |
$22,943,000 |
| 10886244 |
Collars for under-bump metal structures and associated systems and methods |
Giorgio Mariottini, Wayne H. Huang, Anilkumar Chandolu, Mark Bossier |
2021-01-05 |
$21,674,000 |
| 10784224 |
Semiconductor devices with underfill control features, and associated systems and methods |
Suresh Yeruva, Kyle K. Kirby, Owen R. Fay |
2020-09-22 |
$15,633,000 |
| 10770435 |
Apparatuses and methods for semiconductor die heat dissipation |
Xiao Li, Anilkumar Chandolu |
2020-09-08 |
$15,881,000 |
| 10748878 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material |
Jaspreet S. Gandhi, James M. Derderian |
2020-08-18 |
$12,880,000 |
| 10580746 |
Bonding pads with thermal pathways |
Jaspreet S. Gandhi, James M. Derderian, Jian Li |
2020-03-03 |
$19,771,000 |
| 10573612 |
Bonding pads with thermal pathways |
Jaspreet S. Gandhi, James M. Derderian, Jian Li |
2020-02-25 |
$17,014,000 |
| 10559551 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material |
Jaspreet S. Gandhi, James M. Derderian |
2020-02-11 |
$31,921,000 |
| 10541355 |
Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods |
— |
2020-01-21 |
$26,345,000 |
| 10541229 |
Apparatuses and methods for semiconductor die heat dissipation |
Xiao Li, Anilkumar Chandolu |
2020-01-21 |
$26,345,000 |
