Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402332 | Integrated passive devices | Changhan Hobie Yun, Nosun PARK, Paragkumar Ajaybhai Thadesar, Daniel Daeik Kim, Vinay Prakash | 2025-08-26 |
| 12016247 | Package comprising an integrated passive device configured as a cap for a filter | Changhan Hobie Yun, Nosun PARK, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar | 2024-06-18 |
| 12009292 | Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation | Nosun PARK, Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar | 2024-06-11 |
| 11929456 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2024-03-12 |
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2023-10-03 |
| 11735549 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Owen R. Fay, Adriel Jebin Jacob Jebaraj, Wayne H. Huang | 2023-08-22 |
| 11728293 | Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component | Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Nosun PARK | 2023-08-15 |
| 11658403 | Device, package and/or substrate comprising curved antenna | Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Nosun PARK | 2023-05-23 |
| 11631630 | Pillar-last methods for forming semiconductor devices | Anilkumar Chandolu, Wayne H. Huang | 2023-04-18 |
| 11515247 | Capacitance fine tuning by fin capacitor design | Nosun PARK, Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar | 2022-11-29 |
| 11502652 | Substrate comprising capacitor configured for power amplifier output match | Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Nosun PARK | 2022-11-15 |
| 11239158 | Wire bond inductor structures for flip chip dies | Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Daniel Daeik Kim, Francesco Carrara | 2022-02-01 |
| 11139258 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2021-10-05 |
| 11081460 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Owen R. Fay, Adriel Jebin Jacob Jebaraj, Wayne H. Huang | 2021-08-03 |
| 10957625 | Pillar-last methods for forming semiconductor devices | Anilkumar Chandolu, Wayne H. Huang | 2021-03-23 |
| 10916527 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2021-02-09 |
| 10886244 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Wayne H. Huang, Anilkumar Chandolu, Mark Bossier | 2021-01-05 |
| 10784224 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Kyle K. Kirby, Owen R. Fay | 2020-09-22 |
| 10770435 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2020-09-08 |
| 10748878 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2020-08-18 |
| 10580746 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2020-03-03 |
| 10573612 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2020-02-25 |
| 10559551 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2020-02-11 |
| 10541355 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2020-01-21 |
| 10541229 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2020-01-21 |