Issued Patents All Time
Showing 1–25 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033980 | Thermal pads between stacked semiconductor dies and associated systems and methods | Michel Koopmans | 2024-07-09 |
| 12027493 | Fanout integration for stacked silicon package assembly | Suresh Ramalingam | 2024-07-02 |
| 11901300 | Universal interposer for a semiconductor package | Brian C. Gaide | 2024-02-13 |
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, James M. Derderian +1 more | 2023-10-03 |
| 11688664 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Xiao Li | 2023-06-27 |
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2023-02-28 |
| 11488936 | Stacked silicon package assembly having vertical thermal management | Gamal Refai-Ahmed, Suresh Ramalingam, Cheang-Whang Chang | 2022-11-01 |
| 11373989 | Package integration for laterally mounted IC dies with dissimilar solder interconnects | Suresh Ramalingam | 2022-06-28 |
| 11355412 | Stacked silicon package assembly having thermal management | Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Tien-Yu Lee, Suresh Ramalingam +1 more | 2022-06-07 |
| 11315858 | Chip package assembly with enhanced solder resist crack resistance | Yu-Hsiang Sun, Suresh Ramalingam, Tien-Yu Lee | 2022-04-26 |
| 11302674 | Modular stacked silicon package assembly | Suresh Ramalingam, William E. Allaire, Hong Shi, Kerry M. Pierce | 2022-04-12 |
| 11282775 | Chip package assembly with stress decoupled interconnect layer | Suresh Ramalingam | 2022-03-22 |
| 11282776 | High density routing for heterogeneous package integration | Vadim Heyfitch | 2022-03-22 |
| 11217550 | Chip package assembly with enhanced interconnects and method for fabricating the same | Suresh Ramalingam | 2022-01-04 |
| 11195780 | Stacked silicon package assembly having thermal management using phase change material | Gamal Refai-Ahmed, Suresh Ramalingam | 2021-12-07 |
| 11145566 | Stacked silicon package assembly having thermal management | Gamal Refai-Ahmed, Suresh Ramalingam, Cheang-Whang Chang | 2021-10-12 |
| 11139258 | Bonding pads with thermal pathways | James M. Derderian, Sameer S. Vadhavkar, Jian Li | 2021-10-05 |
| 11127643 | Test structures for validating package fabrication process | Vadim Heyfitch | 2021-09-21 |
| 11114360 | Multi-die device structures and methods | Myongseob Kim | 2021-09-07 |
| 10971474 | Package integration for high bandwidth memory | Henley Liu | 2021-04-06 |
| 10930611 | Solder joints for board level reliability | Tien-Yu Lee | 2021-02-23 |
| 10916487 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Xiao Li | 2021-02-09 |
| 10886196 | Semiconductor devices having conductive vias and methods of forming the same | — | 2021-01-05 |
| 10879157 | High density substrate and stacked silicon package assembly having the same | — | 2020-12-29 |
| 10861825 | Interconnect structures with intermetallic palladium joints and associated systems and methods | — | 2020-12-08 |