Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033980 | Thermal pads between stacked semiconductor dies and associated systems and methods | Jaspreet S. Gandhi | 2024-07-09 |
| 11004494 | Memory arrays, and methods of forming memory arrays | Sanh D. Tang, Kuo-Chen Wang, Martin C. Roberts, Diem Thy N. Tran, Hideki Gomi +3 more | 2021-05-11 |
| 10651155 | Thermal pads between stacked semiconductor dies and associated systems and methods | Jaspreet S. Gandhi | 2020-05-12 |
| 10481200 | Semiconductor device test apparatuses comprising at least one test site having an array of pockets | Jaspreet S. Gandhi, James M. Derderian | 2019-11-19 |
| 10461059 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Shijian Luo, David R. Hembree | 2019-10-29 |
| 10269782 | Apparatuses and methods for forming die stacks | — | 2019-04-23 |
| 10242726 | Memory arrays, and methods of forming memory arrays | Sanh D. Tang, Kuo-Chen Wang, Martin C. Roberts, Diem Thy N. Tran, Hideki Gomi +3 more | 2019-03-26 |
| 10153027 | Memory arrays, and methods of forming memory arrays | Sanh D. Tang, Kuo-Chen Wang, Martin C. Roberts, Diem Thy N. Tran, Hideki Gomi +3 more | 2018-12-11 |
| 10126357 | Methods of testing semiconductor devices comprising a die stack having protruding conductive elements | Jaspreet S. Gandhi, James M. Derderian | 2018-11-13 |
| 10096579 | Thermal pads between stacked semiconductor dies and associated systems and methods | Jaspreet S. Gandhi | 2018-10-09 |
| 10083734 | Memory arrays | Sanh D. Tang, Kuo-Chen Wang, Martin C. Roberts, Diem Thy N. Tran, Hideki Gomi +3 more | 2018-09-25 |
| 10062679 | Apparatuses and methods for forming die stacks | — | 2018-08-28 |
| 9881910 | Apparatuses and methods for forming die stacks | — | 2018-01-30 |
| 9818625 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Jian Li, Steven K. Groothuis | 2017-11-14 |
| 9768147 | Thermal pads between stacked semiconductor dies and associated systems and methods | Jaspreet S. Gandhi | 2017-09-19 |
| 9733304 | Semiconductor device test apparatuses | Jaspreet S. Gandhi, James M. Derderian | 2017-08-15 |
| 9711494 | Methods of fabricating semiconductor die assemblies | Luke England, Paul A. Silvestri | 2017-07-18 |
| 9659917 | Apparatuses and methods for forming die stacks | — | 2017-05-23 |
| 9379091 | Semiconductor die assemblies and semiconductor devices including same | Luke England, Paul A. Silvestri | 2016-06-28 |
| 9362143 | Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages | Yangyang SUN, Jaspreet S. Gandhi, Josh D. Woodland, Brandon P. Wirz | 2016-06-07 |
| 9287240 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Jian Li, Steven K. Groothuis | 2016-03-15 |
| 9269700 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Shijian Luo, David R. Hembree | 2016-02-23 |
| 8937309 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Luke England, Paul A. Silvestri | 2015-01-20 |
| 8828798 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Luke England, Paul A. Silvestri | 2014-09-09 |
| 8552567 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Luke England, Paul A. Silvestri | 2013-10-08 |