Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362143 | Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages | Yangyang SUN, Michel Koopmans, Jaspreet S. Gandhi, Brandon P. Wirz | 2016-06-07 |
| 9123700 | Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias | Jaspreet S. Gandhi, Brandon P. Wirz, Yangyang SUN | 2015-09-01 |
| 8492242 | Dry flux bonding device and method | Owen R. Fay, Xiao Li, Shijian Luo, Jaspreet S. Gandhi, Te-Sung Wu | 2013-07-23 |