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Microelectronic devices including stair step structures, and related memory devices, electronic systems, and methods |
Indra V. Chary |
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Memory circuitry and method used in forming memory circuitry |
Jiewei Chen, Jordan D. Greenlee, Silvia Borsari |
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Methods of forming microelectronic devices including differently sized conductive contact structures |
Lingxiao Kong, Li Xu, Indra V. Chary, Sok Han Wong |
2025-10-21 |
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Memory device including support structures and contact structures having different materials |
John F. Hopkins |
2025-10-14 |
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Methods of forming microelectronic device assemblies and packages |
Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more |
2025-01-14 |
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Use of pre-channeled materials for anisotropic conductors |
Mark E. Tuttle, John F. Kaeding, Owen R. Fay, Eiichi Nakano |
2024-07-30 |
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Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Jonathan S. Hacker |
2024-04-09 |
$33,276,000 |
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Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more |
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Device and method for muffling, communication device and wearable device |
Yang Yu, Jiamin Liao, Tao Luo, Heyuan Qiu, Xiaowei Liu +2 more |
2022-12-27 |
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Microelectronic device assemblies and packages and related methods and systems |
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2022-08-09 |
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Die features for self-alignment during die bonding |
Bret K. Street, Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker |
2022-04-12 |
$14,807,000 |
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Semiconductor device with tunable antenna using wire bonds |
Owen R. Fay |
2022-02-15 |
$33,020,000 |
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Mark E. Tuttle, John F. Kaeding, Owen R. Fay, Eiichi Nakano |
2021-10-05 |
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Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Jonathan S. Hacker |
2021-05-11 |
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Jian Zhang, Joshua Pinnolis |
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Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Jonathan S. Hacker |
2020-09-01 |
$15,473,000 |
| 10748857 |
Die features for self-alignment during die bonding |
Bret K. Street, Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker |
2020-08-18 |
$12,880,000 |
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Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
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Semiconductor device packages with direct electrical connections and related methods |
Steven K. Groothuis, Jian Li |
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Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Jonathan S. Hacker |
2020-04-14 |
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Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods |
Michel Koopmans, David R. Hembree |
2019-10-29 |
$24,686,000 |
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Device packaging facility and method, and device processing apparatus utilizing DEHT |
Jian Zhang, Joshua Pinnolis |
2019-05-07 |
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| 10170389 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more |
2019-01-01 |
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| 10134655 |
Semiconductor device packages with direct electrical connections and related methods |
Steven K. Groothuis, Jian Li |
2018-11-20 |
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