Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199068 | Methods of forming microelectronic device assemblies and packages | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2025-01-14 |
| 12051670 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, John F. Kaeding, Owen R. Fay, Eiichi Nakano | 2024-07-30 |
| 11955346 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Jonathan S. Hacker | 2024-04-09 |
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2023-02-28 |
| 11539823 | Device and method for muffling, communication device and wearable device | Yang Yu, Jiamin Liao, Tao Luo, Heyuan Qiu, Xiaowei Liu +2 more | 2022-12-27 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2022-08-09 |
| 11302653 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker | 2022-04-12 |
| 11251516 | Semiconductor device with tunable antenna using wire bonds | Owen R. Fay | 2022-02-15 |
| 11139262 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, John F. Kaeding, Owen R. Fay, Eiichi Nakano | 2021-10-05 |
| 11004697 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Jonathan S. Hacker | 2021-05-11 |
| 10990062 | Display system | Qiaoni WANG, Hui-Fen Chen, Yabin Lin, Xin Xie, Chunmei Yang +3 more | 2021-04-27 |
| 10937757 | Device packaging facility and method, and device processing apparatus utilizing DEHT | Jian Zhang, Joshua Pinnolis | 2021-03-02 |
| 10763131 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Jonathan S. Hacker | 2020-09-01 |
| 10748857 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker | 2020-08-18 |
| 10741468 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2020-08-11 |
| 10679921 | Semiconductor device packages with direct electrical connections and related methods | Steven K. Groothuis, Jian Li | 2020-06-09 |
| 10622223 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Jonathan S. Hacker | 2020-04-14 |
| 10461059 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Michel Koopmans, David R. Hembree | 2019-10-29 |
| 10283481 | Device packaging facility and method, and device processing apparatus utilizing DEHT | Jian Zhang, Joshua Pinnolis | 2019-05-07 |
| 10170389 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2019-01-01 |
| 10134655 | Semiconductor device packages with direct electrical connections and related methods | Steven K. Groothuis, Jian Li | 2018-11-20 |
| 10103134 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Jonathan S. Hacker +1 more | 2018-10-16 |
| 9899293 | Semiconductor device packages with improved thermal management and related methods | Steven K. Groothuis, Jian Li | 2018-02-20 |
| 9865578 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Jonathan S. Hacker +1 more | 2018-01-09 |
| 9824998 | Device packaging facility and method, and device processing apparatus utilizing DEHT | Jian Zhang, Joshua Pinnolis | 2017-11-21 |