Issued Patents All Time
Showing 25 most recent of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424516 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Kunal R. Parekh | 2025-09-23 |
| 12424517 | Monolithic conductive cylinder in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Kunal R. Parekh | 2025-09-23 |
| 12300570 | Grindable heat sink for multiple die packaging | Wei Zhou, Kyle K. Kirby | 2025-05-13 |
| 12278202 | Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods | Bharat Bhushan, Akshay N. Singh, Debjit Datta, Eiichi Nakano | 2025-04-15 |
| 12255163 | Bond pads for semiconductor die assemblies and associated methods and systems | Bharat Bhushan, Akshay N. Singh, Keizo Kawakita | 2025-03-18 |
| 12199068 | Methods of forming microelectronic device assemblies and packages | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2025-01-14 |
| 12183716 | Monolithic conductive columns in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Kunal R. Parekh | 2024-12-31 |
| 12080678 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2024-09-03 |
| 12074094 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Kunal R. Parekh | 2024-08-27 |
| 11776926 | Combination-bonded die pair packaging and associated systems and methods | Kyle K. Kirby | 2023-10-03 |
| 11756844 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Mark E. Tuttle | 2023-09-12 |
| 11658129 | Electrically or temperature activated shape-memory materials for warpage control | — | 2023-05-23 |
| 11410963 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2022-08-09 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2022-08-09 |
| 11410962 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2022-08-09 |
| 11302653 | Die features for self-alignment during die bonding | Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker, Shijian Luo | 2022-04-12 |
| 11289440 | Combination-bonded die pair packaging and associated systems and methods | Kyle K. Kirby | 2022-03-29 |
| 11114415 | Semiconductor device with a layered protection mechanism and associated systems, devices, and methods | Wei Zhou | 2021-09-07 |
| 10943842 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Mark E. Tuttle | 2021-03-09 |
| 10861797 | Electrically or temperature activated shape-memory materials for warpage control | — | 2020-12-08 |
| 10840210 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2020-11-17 |
| 10840209 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2020-11-17 |
| 10748857 | Die features for self-alignment during die bonding | Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker, Shijian Luo | 2020-08-18 |
| 10741528 | Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods | Wei Zhou | 2020-08-11 |
| 10615150 | Semiconductor device with a layered protection mechanism and associated systems, devices, and methods | Wei Zhou | 2020-04-07 |