Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties | William Tandy | 2007-07-03 |
| 7205654 | Programmed material consolidation methods for fabricating heat sinks | Vernon Williams | 2007-04-17 |
| 7105366 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2006-09-12 |
| 7094618 | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape | William Tandy | 2006-08-22 |
| 7074648 | Method for packaging flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2006-07-11 |
| 7026191 | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same | Vernon Williams | 2006-04-11 |
| 7005878 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2006-02-28 |
| 6982177 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2006-01-03 |
| 6972200 | Method for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-12-06 |
| 6967113 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-11-22 |
| 6962826 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-11-08 |
| 6953699 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-10-11 |
| 6953700 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-10-11 |
| 6954081 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-10-11 |
| 6949943 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-09-27 |
| 6916683 | Methods of fabricating a molded ball grid array | William R. Stephenson, Todd O. Bolken | 2005-07-12 |
| 6891108 | Semiconductor packages and methods for making the same | Casey Prindiville, Tongbi Jiang | 2005-05-10 |
| 6858927 | Semiconductor packages and methods for making the same | Casey Prindiville, Tongbi Jiang | 2005-02-22 |
| 6833510 | Semiconductor packages and methods for making the same | Casey Prindiville, Tongbi Jiang | 2004-12-21 |
| 6791198 | Method and apparatus for gate blocking X-outs during a molding process | Casey Prindiville, Cary J. Baerlocher | 2004-09-14 |
| 6779258 | Semiconductor packages and methods for making the same | Casey Prindiville, Tongbi Jiang | 2004-08-24 |
| 6776599 | Method and apparatus for gate blocking X-outs during a molding process | Casey Prindiville, Cary J. Baerlocher | 2004-08-17 |
| 6750070 | Process for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2004-06-15 |
| 6734032 | Method and apparatus for marking a bare semiconductor die | William Tandy | 2004-05-11 |
| 6730998 | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same | Vernon Williams | 2004-05-04 |