| 9048272 |
Devices and method for handling microelectronics assemblies |
Valoris L. Forsyth, Justin L. Lawrence, Jamie J. Wanke, Christopher E. Casey, Michael Forbis +2 more |
2015-06-02 |
$72,734,000 |
| 7476277 |
Apparatus for improving stencil/screen print quality |
Tongbi Jiang, Chad A. Cobbley |
2009-01-13 |
$1,962,000 |
| 7105366 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2006-09-12 |
$2,031,000 |
| 7074648 |
Method for packaging flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2006-07-11 |
$2,452,000 |
| 7005878 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2006-02-28 |
$2,383,000 |
| 6982177 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2006-01-03 |
$1,955,000 |
| 6972200 |
Method for manufacturing flip-chip semiconductor assembly |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2005-12-06 |
$2,816,000 |
| 6967113 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2005-11-22 |
$1,784,000 |
| 6962826 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2005-11-08 |
$2,956,000 |
| 6954081 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2005-10-11 |
$2,076,000 |
| 6953699 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2005-10-11 |
$2,076,000 |
| 6953700 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2005-10-11 |
$2,076,000 |
| 6949943 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2005-09-27 |
$1,169,000 |
| 6793749 |
Automated method of attaching flip-chip devices to a substrate |
Rich Fogal, Chad A. Cobbley |
2004-09-21 |
$1,886,000 |
| 6773523 |
Automated method of attaching flip chip devices to a substrate |
Rich Fogal, Chad A. Cobbley |
2004-08-10 |
$1,379,000 |
| 6750070 |
Process for manufacturing flip-chip semiconductor assembly |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2004-06-15 |
$1,928,000 |
| 6744134 |
Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
Jay W. Roberts, Gregory M. Chapman, Zane Drussel |
2004-06-01 |
$2,776,000 |
| 6669781 |
Method and apparatus for improving stencil/screen print quality |
Tongbi Jiang, Chad A. Cobbley |
2003-12-30 |
$2,987,000 |
| 6641669 |
Method and apparatus for improving stencil/screen print quality |
Tongbi Jiang, Chad A. Cobbley |
2003-11-04 |
$4,567,000 |
| 6638831 |
Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
Jay W. Roberts, Gregory M. Chapman, Zane Drussel |
2003-10-28 |
$3,814,000 |
| 6626222 |
System for fabricating semiconductor components |
— |
2003-09-30 |
$3,105,000 |
| 6607599 |
Apparatus for improving stencil/screen print quality |
Tongbi Jiang, Chad A. Cobbley |
2003-08-19 |
$4,820,000 |
| 6599365 |
Apparatus for improving stencil/screen print quality |
Tongbi Jiang, Chad A. Cobbley |
2003-07-29 |
$3,127,000 |
| 6545498 |
Method for in-line testing of flip-chip semiconductor assemblies |
Chad A. Cobbley, Bret K. Street, Tongbi Jiang |
2003-04-08 |
$1,677,000 |
| 6537400 |
Automated method of attaching flip chip devices to a substrate |
Rich Fogal, Chad A. Cobbley |
2003-03-25 |
$1,989,000 |
