Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9048272 | Devices and method for handling microelectronics assemblies | Valoris L. Forsyth, Justin L. Lawrence, Jamie J. Wanke, Christopher E. Casey, Michael Forbis +2 more | 2015-06-02 |
| 7476277 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, Chad A. Cobbley | 2009-01-13 |
| 7105366 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2006-09-12 |
| 7074648 | Method for packaging flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2006-07-11 |
| 7005878 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2006-02-28 |
| 6982177 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2006-01-03 |
| 6972200 | Method for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2005-12-06 |
| 6967113 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2005-11-22 |
| 6962826 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2005-11-08 |
| 6954081 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2005-10-11 |
| 6953699 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2005-10-11 |
| 6953700 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2005-10-11 |
| 6949943 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2005-09-27 |
| 6793749 | Automated method of attaching flip-chip devices to a substrate | Rich Fogal, Chad A. Cobbley | 2004-09-21 |
| 6773523 | Automated method of attaching flip chip devices to a substrate | Rich Fogal, Chad A. Cobbley | 2004-08-10 |
| 6750070 | Process for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2004-06-15 |
| 6744134 | Use of a reference fiducial on a semiconductor package to monitor and control a singulation method | Jay W. Roberts, Gregory M. Chapman, Zane Drussel | 2004-06-01 |
| 6669781 | Method and apparatus for improving stencil/screen print quality | Tongbi Jiang, Chad A. Cobbley | 2003-12-30 |
| 6641669 | Method and apparatus for improving stencil/screen print quality | Tongbi Jiang, Chad A. Cobbley | 2003-11-04 |
| 6638831 | Use of a reference fiducial on a semiconductor package to monitor and control a singulation method | Jay W. Roberts, Gregory M. Chapman, Zane Drussel | 2003-10-28 |
| 6626222 | System for fabricating semiconductor components | — | 2003-09-30 |
| 6607599 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, Chad A. Cobbley | 2003-08-19 |
| 6599365 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, Chad A. Cobbley | 2003-07-29 |
| 6545498 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2003-04-08 |
| 6537400 | Automated method of attaching flip chip devices to a substrate | Rich Fogal, Chad A. Cobbley | 2003-03-25 |