Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7677429 | Concave face wire bond capillary and method | Michael J. Bettinger, Jennifer A. Due | 2010-03-16 |
| 7416107 | Concave face wire bond capillary and method | Michael J. Bettinger, Jennifer A. Due | 2008-08-26 |
| 7271018 | Method of forming a support frame for semiconductor packages | — | 2007-09-18 |
| 7087116 | Apparatus for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Syed Sajid Ahmad, Tongbi Jiang | 2006-08-08 |
| 7087133 | Methods for application of adhesive tape to semiconductor devices | — | 2006-08-08 |
| 6966480 | Concave face wire bond capillary and method | Michael J. Bettinger, Jennifer A. Due | 2005-11-22 |
| 6956272 | Support frame for semiconductor packages | — | 2005-10-18 |
| 6890384 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Syed Sajid Ahmad, Tongbi Jiang | 2005-05-10 |
| 6883574 | Apparatus for application of adhesive tape to semiconductor devices | — | 2005-04-26 |
| 6818460 | Method for applying adhesives to a lead frame | Walter L. Moden, Syed Sajid Ahmad, Tongbi Jiang | 2004-11-16 |
| 6787382 | Method and system for singulating semiconductor components | Jason Wing | 2004-09-07 |
| 6744134 | Use of a reference fiducial on a semiconductor package to monitor and control a singulation method | Jay W. Roberts, John VanNortwick, Zane Drussel | 2004-06-01 |
| 6683378 | System for singulating semiconductor components utilizing alignment pins | Jason Wing | 2004-01-27 |
| 6638831 | Use of a reference fiducial on a semiconductor package to monitor and control a singulation method | Jay W. Roberts, John VanNortwick, Zane Drussel | 2003-10-28 |
| 6623592 | Methods for application of adhesive tape to semiconductor devices | — | 2003-09-23 |
| 6607019 | Method and apparatus for application of adhesive tape to semiconductor devices | — | 2003-08-19 |
| 6595406 | Concave face wire bond capillary and method | Michael J. Bettinger, Jennifer A. Due | 2003-07-22 |
| 6485778 | Method of applying an adhesive material to lead fingers of a lead frame | Walter L. Moden, Syed Sajid Ahmad, Tongbi Jiang | 2002-11-26 |
| 6439450 | Concave face wire bond capillary | Michael J. Bettinger, Jennifer A. Due | 2002-08-27 |
| 6346152 | Method and apparatus for applying adhesives to a lead frame | Walter L. Moden, Syed Sajid Ahmad, Tongbi Jiang | 2002-02-12 |
| 6336973 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Syed Sajid Ahmad, Tongbi Jiang | 2002-01-08 |
| 6311890 | Concave face wire bond capillary | Michael J. Bettinger, Jennifer A. Due | 2001-11-06 |
| 6267167 | Method and apparatus for application of adhesive tape to semiconductor devices | — | 2001-07-31 |
| 6158647 | Concave face wire bond capillary | Michael J. Bettinger, Jennifer A. Due | 2000-12-12 |
| 6096165 | Method and apparatus for application of adhesive tape to semiconductor devices | — | 2000-08-01 |