Issued Patents All Time
Showing 25 most recent of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347731 | Semiconductor components having conductive vias with aligned back side conductors | Jin Li | 2025-07-01 |
| 12251204 | Blood pressure monitoring system including a liquid filled sensor | Caleb C. Han, Patrick E. O'Brien | 2025-03-18 |
| 12087738 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2024-09-10 |
| 12074244 | Optical sensor package with magnetic component for device attachment | Saijin Liu, Saahil Mehra | 2024-08-27 |
| 11917773 | Systems and methods for magnetic barrier assembly | Saijin Liu | 2024-02-27 |
| 11869809 | Semiconductor components having conductive vias with aligned back side conductors | Jin Li | 2024-01-09 |
| 11646384 | Optoelectronic devices with non-rectangular die shapes | Mathieu Charbonneau-Lefort, Saahil Mehra, Saijin Liu | 2023-05-09 |
| 11594525 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2023-02-28 |
| 11561144 | Wearable electronic device with fluid-based pressure sensing | Caleb C. Han, Brad G. Boozer, Mark G. Walsh, William S. Lee, Jun Zhai +6 more | 2023-01-24 |
| 11422104 | Exposed wire-bonding for sensing liquid and water in electronic devices | Caleb C. Han, Brad G. Boozer, David MacNeil, Gregory B. Arndt, Patrick E. O'Brien +7 more | 2022-08-23 |
| 11398457 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2022-07-26 |
| 11217556 | Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same | Young Do Kweon | 2022-01-04 |
| 11211515 | Edge-mountable semiconductor chip package | Miaolei Yan | 2021-12-28 |
| 10993317 | Wafer level optical module | Yinjuan He, Karthik Shanmugam, Peter R. Harper | 2021-04-27 |
| 10811400 | Wafer level optical module | Yinjuan He, Karthik Shanmugam, Peter R. Harper | 2020-10-20 |
| 10593653 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2020-03-17 |
| 10454241 | VCSEL structure with embedded heat sink | Weiping Li, Xiaofeng Fan | 2019-10-22 |
| 10103512 | VCSEL structure with embedded heat sink | Weiping Li, Xiaofeng Fan | 2018-10-16 |
| 10083931 | Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same | Young Do Kweon | 2018-09-25 |
| 10041847 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Jun Zhai | 2018-08-07 |
| 9735539 | VCSEL structure with embedded heat sink | Weiping Li, Xiaofeng Fan | 2017-08-15 |
| 9661411 | Integrated MEMS microphone and vibration sensor | Caleb C. Han, Jun Zhai | 2017-05-23 |
| 9656856 | Method of lower profile MEMS package with stress isolations | Jie Zhao, Peter Hartwell | 2017-05-23 |
| 9624093 | Method and apparatus of making MEMS packages | Jun Zhai | 2017-04-18 |
| 9574959 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Jun Zhai | 2017-02-21 |