Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12251204 | Blood pressure monitoring system including a liquid filled sensor | Patrick E. O'Brien, Tongbi Jiang | 2025-03-18 |
| 11561144 | Wearable electronic device with fluid-based pressure sensing | Brad G. Boozer, Mark G. Walsh, William S. Lee, Tongbi Jiang, Jun Zhai +6 more | 2023-01-24 |
| 11422104 | Exposed wire-bonding for sensing liquid and water in electronic devices | Brad G. Boozer, David MacNeil, Gregory B. Arndt, Patrick E. O'Brien, Roham Solasi +7 more | 2022-08-23 |
| 10041847 | Various stress free sensor packages using wafer level supporting die and air gap technique | Tongbi Jiang, Jun Zhai | 2018-08-07 |
| 9661411 | Integrated MEMS microphone and vibration sensor | Jun Zhai, Tongbi Jiang | 2017-05-23 |
| 9574959 | Various stress free sensor packages using wafer level supporting die and air gap technique | Tongbi Jiang, Jun Zhai | 2017-02-21 |
| 8969139 | Lead frame array package with flip chip die attach | — | 2015-03-03 |
| 8710636 | Lead frame array package with flip chip die attach | — | 2014-04-29 |