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USPTO Patent Rankings Data through Dec 31, 2025
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Patrick E. O'Brien — 12 Patents

Apple: 5 patents #5,490 of 18,612Top 30%
LSLsi: 4 patents #1,016 of 3,238Top 35%
KWKimberly-Clark Worldwide: 1 patents #2,636 of 1,047Top 255%
Pleasanton, CA: #558 of 3,062 inventorsTop 20%
California: #51,404 of 386,348 inventorsTop 15%
Overall (All Time): #396,045 of 4,157,543Top 10%
12 Patents All Time
Patrick E. O'Brien has been granted 12 US patents while listed as an inventor at Apple. The first was granted in 1995 and the most recent in March 2025. Patrick E. O'Brien ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Patrick E. O'Brien in Pleasanton, CA, US.

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12251204 Blood pressure monitoring system including a liquid filled sensor Caleb C. Han, Tongbi Jiang 2025-03-18
12135855 Electronic device having a biometric input system including a composite cover element Andrew Deng, Timothy Koch, Hui-Shan Chang, Andrew W. Joyce, Henry H. Yang +4 more 2024-11-05 $371,466,000
11422104 Exposed wire-bonding for sensing liquid and water in electronic devices Caleb C. Han, Brad G. Boozer, David MacNeil, Gregory B. Arndt, Roham Solasi +7 more 2022-08-23 $220,432,000
9871897 Sensor stack having a graphical element formed by physical vapor deposition Benjamin B. Lyon, Scott A. Myers 2018-01-16 $88,298,000
9679187 Finger biometric sensor assembly including direct bonding interface and related methods Milind S. Bhagavat, Jun Zhai, Dale R. Setlak, David D. Coons, Kwan-Yu Lai 2017-06-13 $53,900,000
7390142 Underground storage tank access/isolation riser assembly, method, and kit 2008-06-24
7171994 Spillage containment system and kit for underground storage tanks 2007-02-06
5872404 Interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating Brian Lynch 1999-02-16 $7,930,000
5698465 Process for manufacturing an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating Brian Lynch 1997-12-16 $8,742,000
5466635 Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating Brian Lynch 1995-11-14 $16,088,000
5458592 Thermoplastic fibrous nonwoven webs for use as core wraps in absorbent articles Frank P. Abuto, Richard Schmidt, Michael Veith, Anthony John Wisneski 1995-10-17 $15,837,000
5447229 Cot/tab protective shipping apparatus and method Brian Lynch, Adrian Murphy 1995-09-05 $68,605,000