| 12165986 |
Semiconductor package using cavity substrate and manufacturing methods |
JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong |
2024-12-10 |
$32,102,000 |
| 12051611 |
Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby |
Roger D. St. Amand |
2024-07-30 |
$63,232,000 |
| 11410935 |
Semiconductor package using cavity substrate and manufacturing methods |
JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong |
2022-08-09 |
$24,990,000 |
| 11217556 |
Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same |
Tongbi Jiang |
2022-01-04 |
$25,501,000 |
| 11018040 |
Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby |
Roger D. St. Amand |
2021-05-25 |
$12,414,000 |
| 10672715 |
Semiconductor package using cavity substrate and manufacturing methods |
JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong |
2020-06-02 |
$10,598,000 |
| 10154594 |
Printed circuit board |
Jeong Ho Lee, Hyoung Joon Kim, Kyoung Moo Harr, Kyung Seob Oh |
2018-12-11 |
|
| 10083931 |
Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same |
Tongbi Jiang |
2018-09-25 |
$17,810,000 |
| 10062493 |
Electronic component and circuit board having the same mounted thereon |
Geon Se Chang, Jin Hyuck Yang |
2018-08-28 |
|
| 9786428 |
Common mode filter and method of manufacturing the same |
Jin Hyuck Yang, Young Seuck Yoo, Sung Kwon Wi, Hye Won BANG, Geon Se Chang +1 more |
2017-10-10 |
|
| 9741490 |
Power inductor and manufacturing method thereof |
Hye Yeon Cha, Young Seuck Yoo, Hwan Soo Lee, Woon Chul Choi |
2017-08-22 |
|
| 9629260 |
Printed circuit board and method of manufacturing the same |
Seung Wook Park, Jin Gu Kim |
2017-04-18 |
|
| 9577598 |
Thin film type common mode filter |
Young Seuck Yoo, Kang Heon Hur, Young Ghyu Ahn, Chan Yoon, Sung Kwon Wi +2 more |
2017-02-21 |
|
| 9520223 |
Inductor and method for manufacturing the same |
Young Seuck Yoo, Kang Heon Hur, Jin Hyuck Yang, Sung Kwon Wi, Jong Yun Lee |
2016-12-13 |
|
| 9386706 |
Line width protector printed circuit board and method of manufacturing the same |
Sung-Wook Han, Seung Min BAEK, Yoon Su Kim, Young Jae Lee |
2016-07-05 |
|
| 9345142 |
Chip embedded board and method of manufacturing the same |
Seon Hee Moon, Jeong Ho Lee |
2016-05-17 |
|
| 9312150 |
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package |
Nazir Ahmad, Samuel Tam, Kyung-Moon Kim, Rajendra D. Pendse |
2016-04-12 |
|
| 9312587 |
Common mode filter and method of manufacturing the same |
Hong Ryul Lee, Sang Moon Lee |
2016-04-12 |
|
| 9264010 |
Via structure having open stub and printed circuit board having the same |
Dong Hwan Lee, Seung Wook Park, Christian Romero, Jin Gu Kim |
2016-02-16 |
|
| 9240385 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
Tongbi Jiang |
2016-01-19 |
$12,174,000 |
| 9235008 |
Optical connector and optical module having the same |
Seung Wook Park, Christian Romero, Chang Bae Lee |
2016-01-12 |
|
| 9237654 |
Electronic component embedded substrate |
Hong Won Kim, Keun Yong Lee |
2016-01-12 |
|
| 9236847 |
Common mode filter |
Ju Hwan Yang, Sang Moon Lee, Jeong Min Cho, Won Chul Sim |
2016-01-12 |
|
| 9236178 |
Coil component and manufacturing method thereof |
Ju Hwan Yang, Sung Kwon Wi, Jin Hyuck Yang, Sang Moon Lee |
2016-01-12 |
|
| 9236177 |
Common mode filter |
Ju Hwan Yang, Won Chul Sim, Chang Bae Lee, Jin Hong, Keun Yong Lee +1 more |
2016-01-12 |
|
