Issued Patents All Time
Showing 26–50 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230727 | Thin film type common mode filter | Young Seuck Yoo, Kang Heon Hur, Sung Kwon Wi, Ho Jin Yun, Jong Yun Lee +3 more | 2016-01-05 |
| 9209101 | Semiconductor package with a conductive shielding member | Do Jae Yoo, Joon Seok Kang, Chang Bae Lee | 2015-12-08 |
| 9204533 | Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate | Romero CHRISTIAN, Seung Wook Park, Mi Jin Park | 2015-12-01 |
| 9196506 | Method for manufacturing interposer | Hyung Jin Jeon, Jong In Ryu, Seung Wan Shin, Seon Hee Moon, Seung Wook Park | 2015-11-24 |
| 9183979 | Chip inductor and method for manufacturing the same | Hye Yeon Cha, Kang Heon Hur, Sung-Jin Park, Dong Jin Jeong, Jung Min Park +4 more | 2015-11-10 |
| 9173291 | Circuit board and method for manufacturing the same | Sung-Wook Han, Jin Gu Kim, Hyung Jin Jeon, Yoon Su Kim | 2015-10-27 |
| 9153957 | Electrostatic discharge protection device and method for manufacturing the same | Jin Hyuck Yang, Young Seuck Yoo, Sung Kwon Wi, Geon Se Chang, Ju Hwan Yang +1 more | 2015-10-06 |
| 9136702 | Electrostatic discharge protection device and composite electronic component including the same | Sang Moon Lee, Sung Kwon Wi, Ju Hwan Yang, Won Chul Sim | 2015-09-15 |
| 9093736 | Common mode filter and method for manufacturing the same | Jin Gu Kim, Jong Yun Lee, Chang Bae Lee, Young Seuck Yoo | 2015-07-28 |
| 9082536 | Common mode filter | Ju Hwan Yang, Geon Se Chang, Sung Kwon Wi | 2015-07-14 |
| 9009950 | Method for manufacturing high frequency inductor | Sang Moon Lee, Young Seuck Yoo, Jong Yun Lee, Sung Kwon Wi | 2015-04-21 |
| 8994478 | Common mode filter | Won Chul Sim, Hye Won BANG, Ju Hwan Yang, Jin Hyuck Yang | 2015-03-31 |
| 8981889 | Common mode filter with ESD protection pattern built therein | Young Seuck Yoo, Kang Heon Hur, Jun Hee Bae, Yong Suk Kim, Sang Moon Lee +2 more | 2015-03-17 |
| 8951835 | Method of fabricating a package substrate | Seung Wook Park, Jang-Hyun Kim, Tae Seok Park, Su Jeong Suh, Jae Gwon Jang +3 more | 2015-02-10 |
| 8943685 | Method of manufacturing a capacitor-embedded printed circuit board | Sung Yi, Hong Won Kim | 2015-02-03 |
| 8922002 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Tongbi Jiang | 2014-12-30 |
| 8830689 | Interposer-embedded printed circuit board | Jin Gu Kim, Mi Jin Park, Young-Ho Kim, Seung Wook Park, Hee Kon Lee | 2014-09-09 |
| 8756804 | Method of manufacturing printed circuit board | Hyung Jin Jeon, Seung Wook Park, Seon Hee Moon | 2014-06-24 |
| 8704350 | Stacked wafer level package and method of manufacturing the same | Seung Wook Park, Jin Gu Kim, Ju Pyo Hong, Hee Kon Lee, Hyung Jin Jeon +2 more | 2014-04-22 |
| 8658467 | Method of manufacturing stacked wafer level package | Seung Wook Park, Jin Gu Kim, Ju Pyo Hong, Hee Kon Lee, Hyung Jin Jeon +2 more | 2014-02-25 |
| 8624128 | Printed circuit board and manufacturing method thereof | Ju Pyo Hong, Jin Gu Kim, Seon Hee Moon, Dong Jin Lee, Seung Wook Park | 2014-01-07 |
| 8582314 | Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure | Seung Wook Park, Seung Wan Shin, Mi Jin Park, Kyung Seob Oh | 2013-11-12 |
| 8581394 | Semiconductor package module and electric circuit assembly with the same | Seung Wook Park, Mi Jin Park | 2013-11-12 |
| 8409981 | Semiconductor package with a metal post and manufacturing method thereof | Woon Chun Kim, Soon Gyu Yim, Jae Kwang Lee | 2013-04-02 |
| 8373537 | Resistor having parallel structure and method of fabricating the same | Mi Jin Park, Jin Gu Kim | 2013-02-12 |