Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011482 | Fan-out semiconductor package | Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim | 2021-05-18 |
| 10741461 | Fan-out semiconductor package | Hyoung Joon Kim, Kyoung Moo Harr | 2020-08-11 |
| 10714437 | Fan-out semiconductor package | Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim | 2020-07-14 |
| 10622322 | Fan-out semiconductor package and method of manufacturing the fan-out semiconductor | Hyoung Joon Kim, Doo Hwan Lee, Kyoung Moo Harr | 2020-04-14 |
| 10600748 | Fan-out semiconductor package | Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim | 2020-03-24 |
| 10566289 | Fan-out semiconductor package and manufacturing method thereof | Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim | 2020-02-18 |
| 10224288 | Fan-out semiconductor package | Kyoung Moo Harr, Doo Hwan Lee, Seung Chul Oh, Hyoung Joon Kim, Yoon Suk CHO | 2019-03-05 |
| 10211149 | Fan-out semiconductor package | Kyoung Moo Harr, Hyoung Joon Kim | 2019-02-19 |
| 10170382 | Fan-out semiconductor package | Hyoung Joon Kim, Kyoung Moo Harr | 2019-01-01 |
| 10154594 | Printed circuit board | Jeong Ho Lee, Young Do Kweon, Hyoung Joon Kim, Kyoung Moo Harr | 2018-12-11 |
| 9929100 | Electronic component package and method of manufacturing the same | Doo Hwan Lee, Hyoung Joon Kim, Jong Rip Kim, Ung Hui Shin | 2018-03-27 |
| 9905526 | Electronic component package and method of manufacturing the same | Kyoung Moo Harr, Ji Hoon Kim, Sun Ho Kim | 2018-02-27 |
| 9881873 | Fan-out semiconductor package | Kyoung Moo Harr, Doo Hwan Lee, Seung Chul Oh, Hyoung Joon Kim, Yoon Suk CHO | 2018-01-30 |
| 9825003 | Electronic component package and method of manufacturing the same | Young Min Kim | 2017-11-21 |
| 8957319 | Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same | Sung-Wook Han, Yoon Su Kim, Kyoung Moo Harr, Kyung Suk Shim, Du Sung Jung | 2015-02-17 |
| 8582314 | Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure | Seung Wook Park, Young Do Kweon, Seung Wan Shin, Mi Jin Park | 2013-11-12 |
| 8434918 | Lighting apparatus using light emitting device package | Min Sang Lee, Joo-Sung Lee | 2013-05-07 |
| 7935971 | Light emitting diode module | Min Sang Lee, Tae Hong Lee, Won-Hoe Koo | 2011-05-03 |
| 7846754 | High power light emitting diode package and method of producing the same | Jae Ky Roh, Jung Kyu Park, Jong Hwan Baek, Seung Hwan Choi | 2010-12-07 |
| 7598528 | High power light emitting diode package and method of producing the same | Jae Ky Roh, Jung Kyu Park, Jong Hwan Baek, Seung Hwan Choi | 2009-10-06 |
| D591695 | Light-emitting diode module | Min Sang Lee, Tae Hong Lee | 2009-05-05 |