Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8779580 | Electronic component package and manufacturing method thereof | Joon Seok Kang, Sung Yi, Jae-Cheon Doh, Do Jae Yoo, Sun-Kyong Kim | 2014-07-15 |
| 8143099 | Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer | Seung Wook Park, Jin Gu Kim, Jong Yun Lee, Hyung Jin Jeon, Young Do Kweon | 2012-03-27 |
| 7846754 | High power light emitting diode package and method of producing the same | Kyung Seob Oh, Jae Ky Roh, Jung Kyu Park, Seung Hwan Choi | 2010-12-07 |
| 7727877 | Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar | Joon Seok Kang, Sung Yi, Young Do Kweon | 2010-06-01 |
| 7663250 | Wafer level package and manufacturing method thereof | Hyung Jin Jeon, Sung Yi, Jong Yun Lee, Young Do Kweon | 2010-02-16 |
| 7598528 | High power light emitting diode package and method of producing the same | Kyung Seob Oh, Jae Ky Roh, Jung Kyu Park, Seung Hwan Choi | 2009-10-06 |
| 7511312 | Surface mounting device-type light emitting diode | Joon Seok Chae | 2009-03-31 |