Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9075269 | Array substrate and liquid crystal display device including the same | Kyung-Mo Son, Jae Kyun Lee, Taek Jun Jung, Sun-Ju Ku, Soon-Hwan Hong +3 more | 2015-07-07 |
| 8943685 | Method of manufacturing a capacitor-embedded printed circuit board | Young Do Kweon, Hong Won Kim | 2015-02-03 |
| 8893380 | Method of manufacturing a chip embedded printed circuit board | Hong Won Kim, Tae Sung Jeong, Joon Seok Kang | 2014-11-25 |
| 8779580 | Electronic component package and manufacturing method thereof | Joon Seok Kang, Jae-Cheon Doh, Do Jae Yoo, Sun-Kyong Kim, Jong Hwan Baek | 2014-07-15 |
| 8593595 | Color filter using surface plasmon and liquid crystal display device | Se Young Park, Jeong Hyun Kim, Chang-Gu Lee, Cheol-Hwan Lee | 2013-11-26 |
| 8558975 | Liquid crystal display device and method of fabricating the same | Se Young Park, Jeong Hyeon Kim, Chang-Gu Lee | 2013-10-15 |
| 8552305 | Electronic component-embedded printed circuit board | Jin Seon Park, Jung Won Lee | 2013-10-08 |
| 8379171 | Fringe field switching mode liquid crystal display device and method for fabricating the same | Cheol-Hwan Lee, Jeong Hyun Kim, Chang-Gu Lee, Se Young Park | 2013-02-19 |
| 8351215 | Method of manufacturing a chip embedded printed circuit board | Hong Won Kim, Tae Sung Jeong, Joon Seok Kang | 2013-01-08 |
| 8302270 | Method of manufacturing capacitor-embedded PCB | Woon Chun Kim, Hwa-Sun Park, Hong Won Kim, Dae Jun Kim, Jin Seon Park | 2012-11-06 |
| 8283768 | Wafer Level package for heat dissipation and method of manufacturing the same | Joon Seok Kang, Young Do Kweon | 2012-10-09 |
| 8283251 | Method of manufacturing wafer level package | Seung Seoup Lee | 2012-10-09 |
| 8110914 | Wafer level package with removable chip protecting layer | Joon Seok Kang, Young Do Kweon | 2012-02-07 |
| 8064215 | Semiconductor chip package and printed circuit board | Yul Kyo Chung, Soon Gyu Yim, Seog Moon Choi, Jin Gu Kim, Young Do Kweon | 2011-11-22 |
| 8026590 | Die package and method of manufacturing the same | Joon Seok Kang, Young-Ho Kim, Young Do Kweon, Jin Gu Kim | 2011-09-27 |
| 7992296 | PCB and manufacturing method thereof | Woon Chun Kim | 2011-08-09 |
| 7982982 | Wafer level packaging image sensor module having lens actuator and method of manufacturing the same | Seung Seoup Lee | 2011-07-19 |
| 7886414 | Method of manufacturing capacitor-embedded PCB | Woon Chun Kim, Hwa-Sun Park, Hong Won Kim, Dae Jun Kim, Jin Seon Park | 2011-02-15 |
| 7730612 | Method of manufacturing component-embedded printed circuit board | Hwa-Sun Park, Sang Chul Lee, Jong Woon Kim, Yul Kyo Chung | 2010-06-08 |
| 7727877 | Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar | Joon Seok Kang, Jong Hwan Baek, Young Do Kweon | 2010-06-01 |
| 7663250 | Wafer level package and manufacturing method thereof | Hyung Jin Jeon, Jong Yun Lee, Young Do Kweon, Jong Hwan Baek | 2010-02-16 |
| 7632709 | Method of manufacturing wafer level package | Hyung Jin Jeon, Young Do Kweon, Jong Yun Lee, Joon Seok Kang, Seung Wook Park | 2009-12-15 |