Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394703 | Fan-out semiconductor package | Sung Han Kim, Masazumi Amagai, Ju Ho Kim | 2025-08-19 |
| 11810848 | Fan-out semiconductor package | Sung Han Kim, Masazumi Amagai, Ju Ho Kim | 2023-11-07 |
| 11444043 | Substrate having embedded electronic component | Hong In KIM, Thomas A. Kim | 2022-09-13 |
| 11189552 | Semiconductor package | Jae Ean LEE, Young Gwan Ko, Suk Ho Lee, Jung Soo Byun | 2021-11-30 |
| 11094623 | Fan-out semiconductor package | Sung Han Kim, Masazumi Amagai, Ju Ho Kim | 2021-08-17 |
| 10796997 | Semiconductor package | Jae Ean LEE, Han Na Jin, Young Gwan Ko, Jung Soo Byun | 2020-10-06 |
| 10790224 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Young Gwan Ko, Ik Jun Choi, Jung Soo Byun | 2020-09-29 |
| 10665535 | Semiconductor package | Jae Ean LEE, Young Gwan Ko, Suk Ho Lee, Jung Soo Byun | 2020-05-26 |
| 10580812 | Fan-out sensor package and camera module including the same | Ju Ho Kim | 2020-03-03 |
| 10580728 | Fan-out semiconductor package | Sung Han Kim, Masazumi Amagai, Ju Ho Kim | 2020-03-03 |
| 10447411 | Acoustic wave device and method of manufacturing the same | Seung Wook Park, No Il Park | 2019-10-15 |
| 10438884 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Young Gwan Ko, Ik Jun Choi, Jung Soo Byun | 2019-10-08 |
| 10431615 | Fan-out sensor package and camera module including the same | Ju Ho Kim | 2019-10-01 |
| 10340234 | Substrate having embedded electronic component | Hong In KIM, Thomas A. Kim | 2019-07-02 |
| 10340153 | Fan-out semiconductor package and method of manufacturing same | Hong Won Kim | 2019-07-02 |
| 10298199 | Acoustic wave device and method for manufacturing the same | Seung Wook Park, No Il Park | 2019-05-21 |
| 10164602 | Acoustic wave device and method of manufacturing the same | Seung Wook Park, Christian Romero, Seong Hun NA | 2018-12-25 |
| 10048118 | Sensor package having a transparent covering member supported by electronic component and method of manufacturing the same | Seung Wook Park, No Il Park | 2018-08-14 |
| 9673066 | Apparatus and method of manufacturing semiconductor package module | No Il Park, Seung Wook Park, Eung-Suek Lee | 2017-06-06 |
| 9087837 | Semiconductor package and method of manufacturing the same | Doo Hwan Lee, Yul Kyo Chung | 2015-07-21 |
| 8893380 | Method of manufacturing a chip embedded printed circuit board | Hong Won Kim, Sung Yi, Joon Seok Kang | 2014-11-25 |
| 8871569 | Semiconductor package and method of manufacturing the same | Doo Hwan Lee, Yul Kyo Chung | 2014-10-28 |
| 8802999 | Embedded printed circuit board and manufacturing method thereof | Jong In Ryu, Yul Kyo Chung | 2014-08-12 |
| 8780572 | Printed circuit board having electronic component | Doo Hwan Lee | 2014-07-15 |
| 8692391 | Embedded ball grid array substrate and manufacturing method thereof | Doo Hwan Lee, Seung Eun Lee | 2014-04-08 |