Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394703 | Fan-out semiconductor package | Sung Han Kim, Ju Ho Kim, Tae Sung Jeong | 2025-08-19 |
| 11810848 | Fan-out semiconductor package | Sung Han Kim, Ju Ho Kim, Tae Sung Jeong | 2023-11-07 |
| 11094623 | Fan-out semiconductor package | Sung Han Kim, Ju Ho Kim, Tae Sung Jeong | 2021-08-17 |
| 10580728 | Fan-out semiconductor package | Sung Han Kim, Ju Ho Kim, Tae Sung Jeong | 2020-03-03 |
| 8598029 | Method for fabricating flip-attached and underfilled semiconductor devices | Masako Watanabe | 2013-12-03 |
| 8304883 | Semiconductor device having multiple semiconductor elements | Yoshimi Takahashi | 2012-11-06 |
| 8193085 | Method for fabricating flip-attached and underfilled semiconductor devices | Masako Watanabe | 2012-06-05 |
| 8097964 | IC having TSV arrays with reduced TSV induced stress | Jeffrey Alan West, Margaret Simmons-Matthews | 2012-01-17 |
| 7971351 | Method of manufacturing a semiconductor device | Yoshimi Takahashi | 2011-07-05 |
| 7884009 | Semiconductor device with an improved solder joint | — | 2011-02-08 |
| 7786599 | Semiconductor device with an improved solder joint | — | 2010-08-31 |
| 7701071 | Method for fabricating flip-attached and underfilled semiconductor devices | Masako Watanabe | 2010-04-20 |
| 7679002 | Semiconductive device having improved copper density for package-on-package applications | Kenji Masumoto | 2010-03-16 |
| 7626274 | Semiconductor device with an improved solder joint | — | 2009-12-01 |
| 7520052 | Method of manufacturing a semiconductor device | Yoshimi Takahashi | 2009-04-21 |
| 7282175 | Lead-free solder | Masako Watanabe, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi +4 more | 2007-10-16 |
| 7042070 | Direct attachment of semiconductor chip to organic substrate | Chee Kiang Yew | 2006-05-09 |
| 7029542 | Lead-free solder alloy | Masako Watanabe, Kensho Murata, Osamu Munekata, Yoshitaka Toyoda, Minoru Ueshima +2 more | 2006-04-18 |
| 6873059 | Semiconductor package with metal foil attachment film | Akira Karashima | 2005-03-29 |
| 6784022 | Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits | Norito Umehara | 2004-08-31 |
| 6762506 | Assembly of semiconductor device and wiring substrate | Masako Watanabe | 2004-07-13 |
| 6713851 | Lead over chip semiconductor device including a heat sink for heat dissipation | Norito Umehara | 2004-03-30 |
| 6602803 | Direct attachment semiconductor chip to organic substrate | Chee Kiang Yew | 2003-08-05 |
| 6297076 | Process for preparing a semiconductor wafer | Kazuyoshi Ebe, Hideo Senoo | 2001-10-02 |
| 6232661 | Semiconductor device in BGA package and manufacturing method thereof | Norihito Umehara, Kiyoshi Yajima | 2001-05-15 |