Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815642 | Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies | Jeffrey Alan West, Raymundo M. Camenforte | 2014-08-26 |
| 8759154 | TCE compensation for package substrates for reduced die warpage assembly | — | 2014-06-24 |
| 8597978 | Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint | Kurt Peter Wachtler | 2013-12-03 |
| 8575758 | Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies | Jeffrey Alan West, Raymundo M. Camenforte | 2013-11-05 |
| 8526186 | Electronic assembly including die on substrate with heat spreader having an open window on the die | Satoshi Yokoya | 2013-09-03 |
| 8471577 | Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate | Daniel Stillman, James L. Oborny, William John Antheunisse, Norman J. Armendariz, Ramyanshu Datta +1 more | 2013-06-25 |
| 8344749 | Through carrier dual side loop-back testing of TSV die after die attach to substrate | Daniel Stillman, James L. Oborny, William John Antheunisse, Norman J. Armendariz, Ramyanshu Datta +1 more | 2013-01-01 |
| 8344493 | Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips | Jeffrey Alan West, Jeffrey E. Brighton | 2013-01-01 |
| 8313982 | Stacked die assemblies including TSV die | Rajiv Dunne | 2012-11-20 |
| 8298863 | TCE compensation for package substrates for reduced die warpage assembly | — | 2012-10-30 |
| 8288849 | Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint | Kurt Peter Wachtler | 2012-10-16 |
| 8227295 | IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV | Donald C. Abbott | 2012-07-24 |
| 8097964 | IC having TSV arrays with reduced TSV induced stress | Jeffrey Alan West, Masazumi Amagai | 2012-01-17 |
| 6768212 | Semiconductor packages and methods for manufacturing such semiconductor packages | Akira Karashima, Sohichi Kadoguchi | 2004-07-27 |