Issued Patents All Time
Showing 25 most recent of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11230783 | Method and system for electroplating a MEMS device | Kathryn Ann Schuck | 2022-01-25 |
| 10704156 | Method and system for electroplating a MEMS device | Kathryn Ann Schuck | 2020-07-07 |
| 10438816 | Selective planishing method for making a semiconductor device | — | 2019-10-08 |
| 9972506 | Selective planishing method for making a semiconductor device | — | 2018-05-15 |
| 9373572 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum +1 more | 2016-06-21 |
| 9165873 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum +1 more | 2015-10-20 |
| 9142496 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum +1 more | 2015-09-22 |
| 9059185 | Copper leadframe finish for copper wire bonding | — | 2015-06-16 |
| 9006038 | Selective leadframe planishing | — | 2015-04-14 |
| 8963300 | Semiconductor device with selective planished leadframe | — | 2015-02-24 |
| 8697496 | Method of manufacture integrated circuit package | Ubol Udompanyavit, Brian Eugene Parks | 2014-04-15 |
| 8587099 | Leadframe having selective planishing | — | 2013-11-19 |
| 8574931 | Singulation and strip testing of no-lead integrated circuit packages without tape frame | — | 2013-11-05 |
| 8471155 | Metal plugged substrates with no adhesive between metal and polyimide | Usman Mahmood Chaudhry | 2013-06-25 |
| 8242614 | Thermally improved semiconductor QFN/SON package | — | 2012-08-14 |
| 8227298 | Semiconductor package having buss-less substrate | — | 2012-07-24 |
| 8227295 | IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV | Margaret Simmons-Matthews | 2012-07-24 |
| 8158460 | Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds | — | 2012-04-17 |
| 8138026 | Low cost lead-free preplated leadframe having improved adhesion and solderability | — | 2012-03-20 |
| 8044495 | Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds | — | 2011-10-25 |
| 8039317 | Aluminum leadframes for semiconductor QFN/SON devices | — | 2011-10-18 |
| 8039309 | Systems and methods for post-circuitization assembly | Masood Murtuza, Satyendra Singh Chauhan | 2011-10-18 |
| 7939378 | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication | Michael Mitchell, Paul R. Moehle, Douglas W. Romm | 2011-05-10 |
| 7928574 | Semiconductor package having buss-less substrate | — | 2011-04-19 |
| 7918018 | Method of fabricating a semiconductor device | Usman Mahmood Chaudhry | 2011-04-05 |