Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7872336 | Low cost lead-free preplated leadframe having improved adhesion and solderability | — | 2011-01-18 |
| 7863103 | Thermally improved semiconductor QFN/SON package | — | 2011-01-04 |
| 7851928 | Semiconductor device having substrate with differentially plated copper and selective solder | Bernardo Gallegos | 2010-12-14 |
| 7788800 | Method for fabricating a leadframe | — | 2010-09-07 |
| 7608916 | Aluminum leadframes for semiconductor QFN/SON devices | — | 2009-10-27 |
| 7535104 | Structure and method for bond pads of copper-metallized integrated circuits | Howard R. Test | 2009-05-19 |
| 7507605 | Low cost lead-free preplated leadframe having improved adhesion and solderability | — | 2009-03-24 |
| 7504716 | Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking | — | 2009-03-17 |
| 7413974 | Copper-metallized integrated circuits having electroless thick copper bond pads | Howard R. Test | 2008-08-19 |
| 7411303 | Semiconductor assembly having substrate with electroplated contact pads | — | 2008-08-12 |
| 7368807 | Low cost method to produce high volume lead frames | — | 2008-05-06 |
| 7368328 | Semiconductor device having post-mold nickel/palladium/gold plated leads | Edgar Zuniga-Ortiz | 2008-05-06 |
| 7309909 | Leadframes for improved moisture reliability of semiconductor devices | — | 2007-12-18 |
| 7268415 | Semiconductor device having post-mold nickel/palladium/gold plated leads | Edgar Zuniga-Ortiz | 2007-09-11 |
| 7245006 | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication | Michael Mitchell, Paul R. Moehle, Douglas W. Romm | 2007-07-17 |
| 7217656 | Structure and method for bond pads of copper-metallized integrated circuits | Howard R. Test | 2007-05-15 |
| 7192809 | Low cost method to produce high volume lead frames | — | 2007-03-20 |
| 7179738 | Semiconductor assembly having substrate with electroplated contact pads | — | 2007-02-20 |
| 7148085 | Gold spot plated leadframes for semiconductor devices and method of fabrication | Paul R. Moehle | 2006-12-12 |
| 7064008 | Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin | Douglas W. Romm | 2006-06-20 |
| 6995042 | Method for fabricating preplated nickel/palladium and tin leadframes | — | 2006-02-07 |
| 6953986 | Leadframes for high adhesion semiconductor devices and method of fabrication | Michael Mitchell, Paul R. Moehle, Douglas W. Romm | 2005-10-11 |
| 6915566 | Method of fabricating flexible circuits for integrated circuit interconnections | John E. Cotugno, Robert M. Fritzsche, Robert Sabo, Christopher M. Sullivan, David W. West | 2005-07-12 |
| 6849806 | Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor | Douglas W. Romm | 2005-02-01 |
| 6838757 | Preplating of semiconductor small outline no-lead leadframes | Michael Mitchell, Paul R. Moehle | 2005-01-04 |