Howard R. Test — 17 Patents at Texas Instruments

Howard R. Test has been granted 17 US patents while listed as an inventor at Texas Instruments. The first was granted in 1983 and the most recent in September 2013. Howard R. Test ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Howard R. Test in Lubbock, TX, US.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8530279	Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter	—	2013-09-10	$8,150,000
7535104	Structure and method for bond pads of copper-metallized integrated circuits	Donald C. Abbott	2009-05-19	$15,118,000
7413974	Copper-metallized integrated circuits having electroless thick copper bond pads	Donald C. Abbott	2008-08-19	$15,708,000
7294923	Metallization scheme including a low modulus structure	—	2007-11-13	$12,677,000
7265443	Wire bonded semiconductor device having low inductance and noise	Michael A. Lamson	2007-09-04	$20,738,000
7217656	Structure and method for bond pads of copper-metallized integrated circuits	Donald C. Abbott	2007-05-15	$13,934,000
6869875	Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process	—	2005-03-22	$18,900,000
6800555	Wire bonding process for copper-metallized integrated circuits	Gonzalo Amador, Willmar Subido	2004-10-05	$16,258,000
6619538	Nickel plating process having controlled hydrogen concentration	Homer B. Klonis	2003-09-16	$22,828,000
6616967	Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process	—	2003-09-09	$16,608,000
6268662	Wire bonded flip-chip assembly of semiconductor devices	Wei-Yan Shih, Willmar Subido	2001-07-31	$47,917,000
6068180	System, apparatus, and method for connecting a semiconductor chip to a three-dimensional leadframe	—	2000-05-30	$92,682,000
5979743	Method for making an IC device using a single-headed bonder	—	1999-11-09	$37,872,000
5544804	Capillary designs and process for fine pitch ball bonding	Michael Riley Vinson, Albert H. Kuckhahn	1996-08-13	$6,333,000
4874722	Process of packaging a semiconductor device with reduced stress forces	George A. Bednarz, Reginald Smith, Gretchen W. Roeding	1989-10-17	$1,450,000
4423435	Assembly of an electronic device on an insulative substrate	—	1983-12-27	$18,594,000
4388696	Data processing system having dual output modes	Michael J. Drury	1983-06-14	$4,251,000

Howard R. Test — 17 Patents

Issued Patents All Time

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