| 8530279 |
Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter |
— |
2013-09-10 |
| 7535104 |
Structure and method for bond pads of copper-metallized integrated circuits |
Donald C. Abbott |
2009-05-19 |
| 7413974 |
Copper-metallized integrated circuits having electroless thick copper bond pads |
Donald C. Abbott |
2008-08-19 |
| 7294923 |
Metallization scheme including a low modulus structure |
— |
2007-11-13 |
| 7265443 |
Wire bonded semiconductor device having low inductance and noise |
Michael A. Lamson |
2007-09-04 |
| 7217656 |
Structure and method for bond pads of copper-metallized integrated circuits |
Donald C. Abbott |
2007-05-15 |
| 6869875 |
Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process |
— |
2005-03-22 |
| 6800555 |
Wire bonding process for copper-metallized integrated circuits |
Gonzalo Amador, Willmar Subido |
2004-10-05 |
| 6619538 |
Nickel plating process having controlled hydrogen concentration |
Homer B. Klonis |
2003-09-16 |
| 6616967 |
Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process |
— |
2003-09-09 |
| 6268662 |
Wire bonded flip-chip assembly of semiconductor devices |
Wei-Yan Shih, Willmar Subido |
2001-07-31 |
| 6068180 |
System, apparatus, and method for connecting a semiconductor chip to a three-dimensional leadframe |
— |
2000-05-30 |
| 5979743 |
Method for making an IC device using a single-headed bonder |
— |
1999-11-09 |
| 5544804 |
Capillary designs and process for fine pitch ball bonding |
Michael Riley Vinson, Albert H. Kuckhahn |
1996-08-13 |
| 4874722 |
Process of packaging a semiconductor device with reduced stress forces |
George A. Bednarz, Reginald Smith, Gretchen W. Roeding |
1989-10-17 |
| 4423435 |
Assembly of an electronic device on an insulative substrate |
— |
1983-12-27 |
| 4388696 |
Data processing system having dual output modes |
Michael J. Drury |
1983-06-14 |