Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12213258 | Method of manufacture for embedded IC chip directly connected to PCB | Haris Basit, Shinichi Iketani | 2025-01-28 |
| 12063748 | Catalyzed metal foil and uses thereof to produce electrical circuits | Shinichi Iketani, Sunity Sharma, Gary Lawrence Borges | 2024-08-13 |
| 11716819 | Asymmetrical electrolytic plating for a conductive pattern | Shinichi Iketani | 2023-08-01 |
| 11597042 | Printable surface treatment for aluminum bonding | Calvin Chen, Divyakant P. KADIWALA, Sunity Sharma | 2023-03-07 |
| 11076492 | Three dimensional circuit formation | Shinichi Iketani, Haris Basit | 2021-07-27 |
| 10034386 | Patterning of electroless metals by selective deactivation of catalysts | Mihir Reddy, Sunity Sharma | 2018-07-24 |
| 9699914 | Patterning of electroless metals by selective deactivation of catalysts | Mihir Reddy, Sunity Sharma | 2017-07-04 |
| 5884834 | Multi-frequency ultrasonic wire bonder and method | Wei Qin, Lee R. Levine | 1999-03-23 |
| 5544804 | Capillary designs and process for fine pitch ball bonding | Howard R. Test, Albert H. Kuckhahn | 1996-08-13 |