Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5884834 | Multi-frequency ultrasonic wire bonder and method | Michael Riley Vinson, Wei Qin | 1999-03-23 |
| 5205463 | Method of making constant clearance flat link fine wire interconnections | William J. Holdgrafer, Douglas L. Gauntt | 1993-04-27 |
| 5176311 | High yield clampless wire bonding method | Michael J. Sheaffer | 1993-01-05 |
| 5111989 | Method of making low profile fine wire interconnections | William J. Holdgrafer, Michael J. Sheaffer | 1992-05-12 |