Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5176311 | High yield clampless wire bonding method | Lee R. Levine | 1993-01-05 |
| 5111989 | Method of making low profile fine wire interconnections | William J. Holdgrafer, Lee R. Levine | 1992-05-12 |