Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7026710 | Molded package for micromechanical devices and method of fabrication | Anthony L. Coyle | 2006-04-11 |
| 6858910 | Method of fabricating a molded package for micromechanical devices | Anthony L. Coyle | 2005-02-22 |
| 6531083 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas | 2003-03-11 |
| 6489178 | Method of fabricating a molded package for micromechanical devices | Anthony L. Coyle | 2002-12-03 |
| 6071457 | Bellows container packaging system and method | Jeremias P. Libres, Subramanian Krishnamurthy, Thongioem Phanatnok | 2000-06-06 |
| 5955115 | Pre-packaged liquid molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres | 1999-09-21 |
| 5912024 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas | 1999-06-15 |
| 5744083 | Method for molding semiconductor packages | Teong Yu Julius Lim | 1998-04-28 |
| 5624691 | Transfer mold design | Teong Yu Julius Lim | 1997-04-29 |
| 5106784 | Method of making a post molded cavity package with internal dam bar for integrated circuit | — | 1992-04-21 |
| 4874722 | Process of packaging a semiconductor device with reduced stress forces | Reginald Smith, Gretchen W. Roeding, Howard R. Test | 1989-10-17 |