| 7026710 |
Molded package for micromechanical devices and method of fabrication |
Anthony L. Coyle |
2006-04-11 |
| 6858910 |
Method of fabricating a molded package for micromechanical devices |
Anthony L. Coyle |
2005-02-22 |
| 6531083 |
Sproutless pre-packaged molding for component encapsulation |
Mario A. Bolanos, Jeremias L. Libres, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas |
2003-03-11 |
| 6489178 |
Method of fabricating a molded package for micromechanical devices |
Anthony L. Coyle |
2002-12-03 |
| 6071457 |
Bellows container packaging system and method |
Jeremias P. Libres, Subramanian Krishnamurthy, Thongioem Phanatnok |
2000-06-06 |
| 5955115 |
Pre-packaged liquid molding for component encapsulation |
Mario A. Bolanos, Jeremias L. Libres |
1999-09-21 |
| 5912024 |
Sproutless pre-packaged molding for component encapsulation |
Mario A. Bolanos, Jeremias L. Libres, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas |
1999-06-15 |
| 5744083 |
Method for molding semiconductor packages |
Teong Yu Julius Lim |
1998-04-28 |
| 5624691 |
Transfer mold design |
Teong Yu Julius Lim |
1997-04-29 |
| 5106784 |
Method of making a post molded cavity package with internal dam bar for integrated circuit |
— |
1992-04-21 |
| 4874722 |
Process of packaging a semiconductor device with reduced stress forces |
Reginald Smith, Gretchen W. Roeding, Howard R. Test |
1989-10-17 |