| 6531083 |
Sproutless pre-packaged molding for component encapsulation |
Jeremias L. Libres, George A. Bednarz, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas |
2003-03-11 |
| 5965078 |
Method for manufacturing prepackaged molding compound for component encapsulation |
Jeremias L. Libres, Tay Liang Chee, Ireneus J. T. M. Pas |
1999-10-12 |
| 5955115 |
Pre-packaged liquid molding for component encapsulation |
Jeremias L. Libres, George A. Bednarz |
1999-09-21 |
| 5949132 |
Dambarless leadframe for molded component encapsulation |
Jeremias L. Libres, Raymond A. Frechette, Ireneus J. T. M. Pas |
1999-09-07 |
| 5912024 |
Sproutless pre-packaged molding for component encapsulation |
Jeremias L. Libres, George A. Bednarz, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas |
1999-06-15 |
| 5891377 |
Dambarless leadframe for molded component encapsulation |
Jeremias L. Libres, Raymond A. Frechette, Ireneus J. T. M. Pas |
1999-04-06 |
| 5888443 |
Method for manufacturing prepackaged molding compound for component encapsulation |
Jeremias L. Libres, Tay Liang Chee, Ireneus J. T. M. Pas |
1999-03-30 |
| 5885506 |
Pre-packaged molding for component encapsulation |
Jeremias L. Libres, Julius Lim, Tay Liang Chee, Ireneus J. T. M. Pas |
1999-03-23 |
| 5644168 |
Mechanical interlocking of fillers and epoxy/resin |
Jeremias P. Libres, Abbas Ismail Attarwala, Jimmy Liang, Indran B. Nair |
1997-07-01 |