Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6514797 | Underfill applications using film technology | Toh Kok Seng, Tan Chua | 2003-02-04 |
| 5965078 | Method for manufacturing prepackaged molding compound for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, Ireneus J. T. M. Pas | 1999-10-12 |
| 5888443 | Method for manufacturing prepackaged molding compound for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, Ireneus J. T. M. Pas | 1999-03-30 |
| 5885506 | Pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, Julius Lim, Ireneus J. T. M. Pas | 1999-03-23 |