Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6652799 | Method for molding semiconductor components | Liang Chee Tay, Kay Kit-Tan | 2003-11-25 |
| 6514797 | Underfill applications using film technology | Tay Liang Chee, Tan Chua | 2003-02-04 |
| 6439869 | Apparatus for molding semiconductor components | Liang Chee Tay, Kay Kit-Tan | 2002-08-27 |