Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324676 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | See Hiong Leow | 2016-04-26 |
| 8900923 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | See Hiong Leow | 2014-12-02 |
| 8399971 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | See Hiong Leow | 2013-03-19 |
| 7741150 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | See Hiong Leow | 2010-06-22 |
| 6652799 | Method for molding semiconductor components | Toh Kok Seng, Kay Kit-Tan | 2003-11-25 |
| 6544816 | Method of encapsulating thin semiconductor chip-scale packages | Tiang Hock Lim | 2003-04-08 |
| 6439869 | Apparatus for molding semiconductor components | Toh Kok Seng, Kay Kit-Tan | 2002-08-27 |
| 6331737 | Method of encapsulating thin semiconductor chip-scale packages | Tiang Hock Lim | 2001-12-18 |