Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6544816 | Method of encapsulating thin semiconductor chip-scale packages | Liang Chee Tay | 2003-04-08 |
| 6331737 | Method of encapsulating thin semiconductor chip-scale packages | Liang Chee Tay | 2001-12-18 |